SCHEMBL20239052

SCHEMBL20239052

C=CC12C=CC3OC3(C=C)C1O2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19726755 0.43
SCHEMBL1639875 0.39
SCHEMBL4645682 0.33
SCHEMBL23392629 0.33
SCHEMBL151208 0.33
SCHEMBL2414575 0.33
SCHEMBL2970488 0.33
Iodide SCHEMBL11547593 0.30
Iodide SCHEMBL4450484 0.30
Iodide SCHEMBL4450480 0.30

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114605355-A Preparation and application of divinylarene diepoxide and curing product thereof 国科广化(南雄)新材料研究院有限公司 2022-06-10 CN disclosed
EP-3320014-B1 CURABLE COMPOSITIONS BASF SE (DE) 2022-04-06 EP disclosed
CN-107849224-B Curable composition 巴斯夫欧洲公司 2021-06-08 CN disclosed
US-10829588-B2 Curable compositions BASF SE (DE) 2020-11-10 US disclosed
US-10190028-B2 Epoxy two-part formulations DOW GLOBAL TECHNOLOGIES LLC (US) 2019-01-29 US disclosed
US-20180201722-A1 CURABLE COMPOSITIONS BASF SE (DE) 2018-07-19 US disclosed
US-20180163100-A1 EPOXY TWO-PART FORMULATIONS DOW EUROPE GMBH (CH) 2018-06-14 US disclosed