Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 8/20 | 0.57 |
| ▸ | HPGD | P15428 | 1/20 | 0.57 |
| ▸ | HCAR2 | Q8TDS4 | 5/20 | 0.54 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
| ▸ | TP53 | P04637 | 2/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | THRB | P10828 | 2/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3361083 | 0.94 | TSHR (0.61) | TSHRHPGDHCAR2ATMALDH1A1 | |
| Acrylic Acid Ethyl Ester SCHEMBL3421934 | 0.94 | TSHR (0.54) | TSHRHPGDHCAR2ATMALDH1A1 | |
| Acrylic Acid SCHEMBL10629796 | 0.90 | HCAR2 (0.57) | TSHRHPGDHCAR2ATMALDH1A1 | |
| SCHEMBL3360217 | 0.90 | TSHR (0.55) | TSHRHPGDHCAR2ATMALDH1A1 | |
| SCHEMBL2778233 | 0.89 | TSHR (0.58) | TSHRHPGDHCAR2ATMALDH1A1 | |
| SCHEMBL5859055 | 0.89 | TSHR (0.58) | TSHRHPGDHCAR2ATMALDH1A1 | |
| Acrylic Acid Methyl Ester SCHEMBL4640900 | 0.89 | HCAR2 (0.54) | TSHRHPGDHCAR2ATMALDH1A1 | |
| Fumaric Acid SCHEMBL3997167 | 0.88 | TSHR (0.73) | TSHRHPGDHCAR2ATMALDH1A1 | |
| SCHEMBL1078981 | 0.88 | HCAR2 (0.62) | TSHRHPGDHCAR2ATMALDH1A1 | |
| Butadiene SCHEMBL11319000 | 0.87 | HCAR2 (0.57) | TSHRHPGDHCAR2ATMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11598031-B2 | Article including multi-component fibers and hollow ceramic microspheres and methods of making and using the same | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2023-03-07 | — | — | US | disclosed |
| EP-2729634-B1 | ARTICLE INCLUDING MULTI-COMPONENT FIBERS AND HOLLOW CERAMIC MICROSPHERES AND METHODS OF MAKING AND USING THE SAME | 3M INNOVATIVE PROPERTIES CO (US) | 2018-08-22 | — | — | EP | disclosed |
| US-20140141676-A1 | ARTICLE INCLUDING MULTI-COMPONENT FIBERS AND HOLLOW CERAMIC MICROSPHERES AND METHODS OF MAKING AND USING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2014-05-22 | — | — | US | disclosed |
| CN-103649429-A | Article including multi-component fibers and hollow ceramic microspheres and methods of making and using the same | 3M INNOVATIVE PROPERTIES CO | 2014-03-19 | — | — | CN | disclosed |
| US-20130240141-A1 | HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE | NITTO DENKO CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| EP-2639277-A1 | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape | Nitto Denko Corporation (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-8524361-B2 | Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet | NITTO DENKO CORPORATION (JP) | 2013-09-03 | — | — | US | disclosed |
| US-8436481-B2 | Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet | NITTO DENKO CORPORATION (JP) | 2013-05-07 | — | — | US | disclosed |
| US-20110151625-A1 | HEAT-RESISTANT ADHESIVE SHEET FOR SUBSTRATELESS SEMICONDUCTOR PACKAGE FABRICATION AND METHOD FOR FABRICATING SUBSTRATELESS SEMICONDUCTOR PACKAGE USING THE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-06-23 | — | — | US | disclosed |
| CN-101682994-B | Manufacturing method of fpcb | HAEUN CHEMTEC CO LTD | 2011-06-15 | — | — | CN | disclosed |
| US-20100224316-A1 | HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET | NITTO DENKO CORPORATION (JP) | 2010-09-09 | — | — | US | disclosed |
| CN-101682994-A | Manufacturing method of fpcb | HAEUN CHEMTEC CO LTD | 2010-03-24 | — | — | CN | disclosed |
| US-5120360-A | Microcapsule-containing ink composition for flexographic printing | KANZAKI PAPER MANUFACTURING CO., LTD. (JP) | 1992-06-09 | — | — | US | disclosed |