SCHEMBL20485148

SCHEMBL20485148

O=[Fe].[BiH3].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1221937 0.89
SCHEMBL316189 0.89
SCHEMBL1933384 0.80
SCHEMBL9139139 0.80
SCHEMBL3277845 0.80
SCHEMBL25181127 0.80
SCHEMBL25344458 0.80
SCHEMBL22117317 0.80
SCHEMBL7267996 0.80
SCHEMBL5953770 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260121003-A1 STAGE AND PLASMA PROCESSING APPARATUS TOKYO ELECTRON LIMITED (JP) 2026-04-30 US claimed
US-12529554-B2 Sensor and band pass filter FUJIFILM CORPORATION (JP) 2026-01-20 US claimed
CN-220569197-U Fingerprint sensor and electronic device comprising same 三星显示有限公司 2024-03-08 CN claimed
CN-115705744-A Fingerprint sensor and electronic device comprising same 三星显示有限公司 2023-02-17 CN claimed
US-20260121003-A1 STAGE AND PLASMA PROCESSING APPARATUS TOKYO ELECTRON LIMITED (JP) 2026-04-30 US disclosed
US-12590012-B2 Negative thermal expansion material and composite material NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2026-03-31 US disclosed
US-12529554-B2 Sensor and band pass filter FUJIFILM CORPORATION (JP) 2026-01-20 US disclosed
US-12378417-B2 Cured product of resin composition, laminate, and resin composition NIPPON SHEET GLASS COMPANY, LIMITED (JP) 2025-08-05 US disclosed
EP-3778701-B1 CURED PRODUCT OF RESIN COMPOSITION, LAMINATE AND RESIN COMPOSITION NIPPON SHEET GLASS CO LTD (JP) 2025-07-09 EP disclosed
US-12297123-B2 Negative thermal expansion material, method for producing the same, and composite material NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2025-05-13 US disclosed
US-12275646-B1 Negative thermal expansion material, method for producing the same, and composite material NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2025-04-15 US disclosed
WO-2025074578-A1 PRINTED WIRING BOARD 三菱電機株式会社 2025-04-10 WO disclosed
EP-3360848-B1 NEGATIVE THERMAL EXPANSION MATERIAL AND COMPOSITE MATERIAL INCLUDING SAME NIPPON CHEMICAL IND (JP) 2020-12-16 EP disclosed
CN-111918899-A Cured product of resin composition, laminate, and resin composition 日本板硝子株式会社 2020-11-10 CN disclosed
WO-2019187988-A1 CURED PRODUCT OF RESIN COMPOSITION, LAMINATE AND RESIN COMPOSITION 日本板硝子株式会社 2019-10-03 WO disclosed
US-20190295832-A1 Member for use in mass spectrometer SHIMADZU CORPORATION (JP) 2019-09-26 US disclosed
US-10280086-B2 Negative thermal expansion material and composite material comprising same NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2019-05-07 US disclosed
US-10167197-B2 Method for producing zirconium tungsten phosphate NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2019-01-01 US disclosed
US-20180265358-A1 METHOD FOR PRODUCING ZIRCONIUM TUNGSTEN PHOSPHATE NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2018-09-20 US disclosed
US-20180251376-A1 NEGATIVE THERMAL EXPANSION MATERIAL AND COMPOSITE MATERIAL COMPRISING SAME NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2018-09-06 US disclosed