⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23825147 | 1.00 | — | — | |
| SCHEMBL10643237 | 1.00 | — | — | |
| SCHEMBL3004481 | 1.00 | — | — | |
| SCHEMBL23825016 | 1.00 | — | — | |
| SCHEMBL2998996 | 0.98 | — | — | |
| SCHEMBL9444846 | 0.93 | — | — | |
| SCHEMBL23825206 | 0.93 | — | — | |
| SCHEMBL23825173 | 0.91 | — | — | |
| SCHEMBL28017218 | 0.91 | — | — | |
| SCHEMBL3010565 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12069936-B2 | Electronic device and method for slot-die depositing layers of the same | EMPA Eidgenössische Materialprüfungs-und Forschungsanstalt (CH) | 2024-08-20 | — | — | US | disclosed |
| CN-110168765-B | Method of forming organic Electroluminescent (EL) element | 默克专利有限公司 | 2023-04-04 | — | — | CN | disclosed |
| CN-110168764-B | Method of forming organic elements of electronic devices | 默克专利有限公司 | 2023-04-04 | — | — | CN | disclosed |
| US-20210210685-A1 | Novel Electronic Device and Method for Slot-Die Depositing Layers of the Same | EMPA EIDGENÖSSISCHE MATERIALPRÜFUNGS- UND FORSCHUNGSANSTALT (CH) | 2021-07-08 | — | — | US | disclosed |
| CN-112930606-A | Method for forming organic element of electronic device | 默克专利有限公司 | 2021-06-08 | — | — | CN | disclosed |
| EP-3794652-A1 | NOVEL ELECTRONIC DEVICE AND METHOD FOR SLOT-DIE DEPOSITING LAYERS OF THE SAME | EMPA Eidgenössische Materialprüfungs- und Forschungsanstalt (CH) | 2021-03-24 | — | — | EP | disclosed |
| CN-107836046-B | Compositions comprising organic semiconducting compounds | 默克专利有限公司 | 2020-08-04 | — | — | CN | disclosed |
| EP-2559079-B1 | COMPOSITION AND METHOD FOR PREPARATION OF ORGANIC ELECTRONIC DEVICES | MERCK PATENT GMBH (DE) | 2020-04-01 | — | — | EP | disclosed |
| US-10256408-B2 | Composition and method for preparation of organic electronic devices | MERCK PATENT GMBH (DE) | 2019-04-09 | — | — | US | disclosed |
| EP-3077475-B1 | COMPOSITIONS CONTAINING A POLYMERIC BINDER WHICH COMPRISES ACRYLIC AND/OR METHACRYLIC ACID ESTER UNITS | MERCK PATENT GMBH (DE) | 2018-07-04 | — | — | EP | disclosed |
| EP-2725632-A1 | USE OF COMPOSITIONS COMPRISING POLYMERIC INERT BINDERS FOR THE FABRICAITON OF LIGHT-EMITTING DIODE | Merck Patent GmbH (DE) | 2014-04-30 | — | — | EP | disclosed |
| EP-2559078-A1 | COMPOSITION HAVING IMPROVED PERFORMANCE | Merck Patent GmbH (DE) | 2013-02-20 | — | — | EP | disclosed |
| EP-2559079-A1 | COMPOSITION AND METHOD FOR PREPARATION OF ORGANIC ELECTRONIC DEVICES | Merck Patent GmbH (DE) | 2013-02-20 | — | — | EP | disclosed |
| US-20130026415-A1 | COMPOSITION HAVING IMPROVED PERFORMANCE | MERCK PATENT GMBH (DE) | 2013-01-31 | — | — | US | disclosed |
| US-20130026421-A1 | COMPOSITION AND METHOD FOR PREPARATION OF ORGANIC ELECTRONIC DEVICES | MERCK PATENT GMBH (DE) | 2013-01-31 | — | — | US | disclosed |
| US-20120273736-A1 | COMPOSITIONS COMPRISING POLYMERIC BINDERS | MERCK PATENT GMBH (DE) | 2012-11-01 | — | — | US | disclosed |
| EP-2517274-A1 | COMPOSITIONS COMPRISING POLYMERIC BINDERS | Merck Patent GmbH (DE) | 2012-10-31 | — | — | EP | disclosed |
| WO-2011128035-A1 | COMPOSITION AND METHOD FOR PREPARATION OF ORGANIC ELECTRONIC DEVICES | MERCK PATENT GMBH (DE) | 2011-10-20 | — | — | WO | disclosed |
| WO-2011128034-A1 | COMPOSITION HAVING IMPROVED PERFORMANCE | MERCK PATENT GMBH (DE) | 2011-10-20 | — | — | WO | disclosed |
| WO-2011076325-A1 | COMPOSITIONS COMPRISING POLYMERIC BINDERS | MERCK PATENT GMBH (DE) | 2011-06-30 | — | — | WO | disclosed |