SCHEMBL20565299

SCHEMBL20565299

C=C(C)COC(CC)[Si](O)(O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7864101 0.85
SCHEMBL4080215 0.83
SCHEMBL15477682 0.81
SCHEMBL4635333 0.81
SCHEMBL524562 0.81
SCHEMBL15477755 0.81
SCHEMBL4393496 0.81
SCHEMBL30074 0.79
SCHEMBL1772847 0.79
SCHEMBL22577184 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11626617-B2 Gel electrolytes and the manufacture thereof CORNELL UNIVERSITY (US) 2023-04-11 US disclosed
WO-2022263304-A1 THERMOPLASTIC MOLDING COMPOUND HAVING IMPROVED MECHANICAL AND LITTLE SHRINKAGE COVESTRO DEUTSCHLAND AG (DE) 2022-12-22 WO disclosed
EP-3697847-A1 FLAME-RESISTANT FILLING-MATERIAL-REINFORCED POLYCARBONATE COMPOSITION HAVING A REDUCED BISPHENOL-A CONTENT Covestro Deutschland AG (DE) 2020-08-26 EP disclosed
US-20200153040-A1 GEL ELECTROLYTES AND THE MANUFACTURE THEREOF CORNELL UNIVERSITY 2020-05-14 US disclosed
WO-2019076495-A1 FLAME-RESISTANT FILLING-MATERIAL-REINFORCED POLYCARBONATE COMPOSITION HAVING A REDUCED BISPHENOL-A CONTENT COVESTRO DEUTSCHLAND AG (DE) 2019-04-25 WO disclosed
WO-2018213447-A1 GEL ELECTROLYTES AND THE MANUFACTURE THEREOF CORNELL UNIVERSITY (US) 2018-11-22 WO disclosed