SCHEMBL2058046

SCHEMBL2058046

OCCCSCCCCCCSCCCO

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
LMNA P02545 2/20 0.35
HSD17B10 Q99714 2/20 0.35
ALDH1A1 P00352 2/20 0.35
TSHR P16473 2/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
CES2 O00748 1/20 0.33
GMNN O75496 1/20 0.33
TP53 P04637 1/20 0.33
POLB P06746 1/20 0.33
MAPT P10636 1/20 0.33
THRB P10828 1/20 0.33
CYP2C9 P11712 1/20 0.33
BLM P54132 1/20 0.33
BHMT Q93088 1/20 0.31
PRKD3 O94806 1/20 0.31
PRKCG P05129 1/20 0.31
PRKCB P05771 1/20 0.31
PRKCA P17252 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28420270 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL2058519 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL8671812 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL9284388 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL7238176 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL11938137 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL8670009 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444573 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444525 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444464 0.93 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11643742-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2023-05-09 US claimed
EP-4162100-A1 SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME MacDermid Enthone Inc. (US) 2023-04-12 EP claimed
CN-115605635-A Silver/tin electroplating bath and method of use 麦克德米德乐思公司(US) 2023-01-13 CN claimed
US-20220170172-A1 Silver/Tin Electroplating Bath and Method of Using the Same MACDERMID ENTHONE INC (US) 2022-06-02 US claimed
US-11280014-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2022-03-22 US claimed
US-20210381121-A1 Silver/Tin Electroplating Bath and Method of Using the Same MACDERMID ENTHONE INC. 2021-12-09 US claimed
EP-3004429-B1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS ROHM & HAAS ELECT MAT (US) 2018-07-18 EP claimed
EP-3816325-B1 ACIDIC AQUEOUS SILVER-NICKEL ALLOY ELECTROPLATING COMPOSITIONS AND METHODS DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) 2025-05-07 EP disclosed
CN-110176441-B Copper pillars with improved integrity and method of making same 罗门哈斯电子材料有限责任公司 2023-08-01 CN disclosed
US-11643742-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2023-05-09 US disclosed
EP-4162100-A1 SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME MacDermid Enthone Inc. (US) 2023-04-12 EP disclosed
CN-115605635-A Silver/tin electroplating bath and method of use 麦克德米德乐思公司(US) 2023-01-13 CN disclosed
EP-4098778-A1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS Rohm and Haas Electronic Materials LLC (US) 2022-12-07 EP disclosed
US-20150240375-A1 CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2015-08-27 US disclosed
EP-2910667-A1 CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS Rohm and Haas Electronic Materials LLC (US) 2015-08-26 EP disclosed
US-20140353162-A1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2014-12-04 US disclosed
US-7968444-B2 Lead-free tin alloy electroplating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-06-28 US disclosed
US-20100216302-A1 Lead-free tin alloy electroplating compositions and methods ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) 2010-08-26 US disclosed
EP-2221396-A1 Lead-Free Tin Alloy Electroplating Compositions and Methods Rohm and Haas Electronic Materials LLC (US) 2010-08-25 EP disclosed
US-5162585-A Preparation of dihydroxy bis-sulfides PHILLIPS PETROLEUM COMPANY (US) 1992-11-10 US disclosed