SCHEMBL2058233

SCHEMBL2058233

OCCCCSCCCCCCCCCCCSCCCCO

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
LMNA P02545 2/20 0.42
HSD17B10 Q99714 2/20 0.42
ALDH1A1 P00352 2/20 0.42
TSHR P16473 2/20 0.42
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
SMN1; SMN2 Q16637 2/20 0.37
GPR84 Q9NQS5 1/20 0.36
FFAR1 O14842 1/20 0.36
FFAR4 Q5NUL3 1/20 0.36
KDM4E B2RXH2 1/20 0.35
CES2 O00748 1/20 0.33
GMNN O75496 1/20 0.33
TP53 P04637 1/20 0.33
POLB P06746 1/20 0.33
MAPT P10636 1/20 0.33
THRB P10828 1/20 0.33
CYP2C9 P11712 1/20 0.33
BLM P54132 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11938137 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL9284388 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444464 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL8673529 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL8670009 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL7238176 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444573 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444525 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL22444517 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR
SCHEMBL2058488 1.00 TDP1 (0.50) TDP1LMNAHSD17B10ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3004429-B1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS ROHM & HAAS ELECT MAT (US) 2018-07-18 EP claimed
EP-3816325-B1 ACIDIC AQUEOUS SILVER-NICKEL ALLOY ELECTROPLATING COMPOSITIONS AND METHODS DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) 2025-05-07 EP disclosed
EP-4098778-A1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS Rohm and Haas Electronic Materials LLC (US) 2022-12-07 EP disclosed
US-11434577-B2 Acid aqueous binary silver-bismuth alloy electroplating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2022-09-06 US disclosed
EP-3816326-B1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS ROHM & HAAS ELECT MAT (US) 2022-06-29 EP disclosed
US-20220112619-A1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC 2022-04-14 US disclosed
US-11242609-B2 Acidic aqueous silver-nickel alloy electroplating compositions and methods Rohm and Hass Electronic Materials LLC (US) 2022-02-08 US disclosed
EP-3835459-A1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS Rohm and Haas Electronic Materials LLC (US) 2021-06-16 EP disclosed
CN-112941578-A Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods 罗门哈斯电子材料有限责任公司 2021-06-11 CN disclosed
US-20210172082-A1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC 2021-06-10 US disclosed
CN-105463528-A Cyanide-free electroplating baths for white bronze based on copper (I) ions ROHM & HAAS ELECT MAT 2016-04-06 CN disclosed
US-20150240375-A1 CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2015-08-27 US disclosed
EP-2910667-A1 CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS Rohm and Haas Electronic Materials LLC (US) 2015-08-26 EP disclosed
WO-2014165867-A1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-10-09 WO disclosed
CN-102051645-B Lead-free tin alloy electroplating compositions and methods ROHM & HAAS ELECT MAT 2013-05-08 CN disclosed
US-7968444-B2 Lead-free tin alloy electroplating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-06-28 US disclosed
CN-102051645-A Lead-free tin alloy electroplating compositions and methods ROHM & HAAS ELECT MAT 2011-05-11 CN disclosed
US-20100216302-A1 Lead-free tin alloy electroplating compositions and methods ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) 2010-08-26 US disclosed
EP-2221396-A1 Lead-Free Tin Alloy Electroplating Compositions and Methods Rohm and Haas Electronic Materials LLC (US) 2010-08-25 EP disclosed
US-5162585-A Preparation of dihydroxy bis-sulfides PHILLIPS PETROLEUM COMPANY (US) 1992-11-10 US disclosed