SCHEMBL2058467

SCHEMBL2058467

OCCSCCCCSCCO

nearest known ligand 0.77

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.77
ROCK2 O75116 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2058568 0.96 TDP1 (0.71) TDP1ROCK2
SCHEMBL2058471 0.96 TDP1 (0.71) TDP1ROCK2
Tiadenol SCHEMBL153097 0.96 TDP1 (0.71) TDP1ROCK2
SCHEMBL5170349 0.96 TDP1 (0.71) TDP1ROCK2
SCHEMBL3388643 0.93
SCHEMBL2423730 0.92 TDP1 (0.77) TDP1ROCK2SMN1; SMN2
SCHEMBL7081214 0.90 TDP1 (0.62) TDP1ROCK2SMN1; SMN2
SCHEMBL8985688 0.90 TDP1 (0.62) TDP1ROCK2
SCHEMBL8675302 0.90 TDP1 (0.62) TDP1ROCK2SMN1; SMN2
SCHEMBL6013179 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11643742-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2023-05-09 US claimed
EP-4162100-A1 SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME MacDermid Enthone Inc. (US) 2023-04-12 EP claimed
CN-115605635-A Silver/tin electroplating bath and method of use 麦克德米德乐思公司(US) 2023-01-13 CN claimed
US-20220170172-A1 Silver/Tin Electroplating Bath and Method of Using the Same MACDERMID ENTHONE INC (US) 2022-06-02 US claimed
US-11280014-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2022-03-22 US claimed
US-20210381121-A1 Silver/Tin Electroplating Bath and Method of Using the Same MACDERMID ENTHONE INC. 2021-12-09 US claimed
EP-3004429-B1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS ROHM & HAAS ELECT MAT (US) 2018-07-18 EP claimed
EP-1195259-B1 Sheet for ink jet-recording OJI PAPER CO (JP) 2007-04-25 EP claimed
EP-1323784-B1 Resin composition for coating optical fiber and coated optical fiber and optical fiber unit using the same DAINIPPON INK & CHEMICALS (JP) 2005-02-16 EP claimed
US-6852378-B2 Sheet for ink jet-recording OJI PAPER CO., LTD. (JP) 2005-02-08 US claimed
US-6850682-B2 Resin composition for coating optical fiber and coated optical fiber and optical fiber unit using the same DAINIPPON INK AND CHEMICALS, INC. (JP) 2005-02-01 US claimed
US-20040058099-A1 Sheet for ink jet-recording OJI PAPER CO., LTD. 2004-03-25 US claimed
US-20030138231-A1 Resin composition for coating optical fiber and coated optical fiber and optical fiber unit using the same DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-07-24 US claimed
EP-1323784-A1 Resin composition for coating optical fiber and coated optical fiber and optical fiber unit using the same DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-07-02 EP claimed
EP-3816325-B1 ACIDIC AQUEOUS SILVER-NICKEL ALLOY ELECTROPLATING COMPOSITIONS AND METHODS DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) 2025-05-07 EP disclosed
CN-112663101-B Acidic aqueous silver-nickel alloy electroplating compositions and methods 罗门哈斯电子材料有限责任公司 2024-09-20 CN disclosed
CN-110176441-B Copper pillars with improved integrity and method of making same 罗门哈斯电子材料有限责任公司 2023-08-01 CN disclosed
EP-0995765-A1 PROCESS FOR PRODUCING EPOXY ESTER RESINS AND PHOTOSENSITIVE RESIN COMPOSITIONS CONTAINING THEM TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 2000-04-26 EP disclosed
US-5162585-A Preparation of dihydroxy bis-sulfides PHILLIPS PETROLEUM COMPANY (US) 1992-11-10 US disclosed
US-4402755-A HYDROLYZED DICHLORO-S-TRIAZINE DERIVATIVE KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1983-09-06 US disclosed