⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29350902 | 1.00 | — | — | |
| SCHEMBL29624160 | 1.00 | — | — | |
| SCHEMBL4896740 | 1.00 | — | — | |
| SCHEMBL29923198 | 1.00 | — | — | |
| SCHEMBL31425261 | 1.00 | — | — | |
| SCHEMBL8061677 | 0.82 | — | — | |
| SCHEMBL11582902 | 0.82 | — | — | |
| SCHEMBL26466 | 0.82 | — | — | |
| SCHEMBL11521638 | 0.82 | — | — | |
| SCHEMBL2044170 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260023419-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECH CO LTD (CN) | 2026-01-22 | — | — | US | claimed |
| EP-4629765-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | Huawei Technologies Co., Ltd. (CN) | 2025-10-08 | — | — | EP | claimed |
| CN-222985263-U | Copper-aluminum-copper double-sided composite belt rolling machine | 江苏扬铜新材料有限公司 | 2025-06-17 | — | — | CN | claimed |
| CN-222890312-U | Copper-aluminum-copper composite board solid-liquid casting-rolling composite production line | 慈溪驰马金属制品有限公司 | 2025-05-23 | — | — | CN | claimed |
| CN-119526847-A | High-strength high-conductivity copper-aluminum-copper composite material and preparation process thereof | 江苏中色复合材料有限公司 | 2025-02-28 | — | — | CN | claimed |
| CN-119456665-A | Copper-aluminum-copper composite material and processing method and application thereof | 浙江新帮新材料有限公司 | 2025-02-18 | — | — | CN | claimed |
| CN-116321969-B | Heat radiation structure and electronic equipment | 华为技术有限公司 | 2024-12-24 | — | — | CN | claimed |
| CN-222139310-U | Conductive connection structure of sodium chlorate electrolytic tank | 兰州泰邦化工科技有限公司 | 2024-12-10 | — | — | CN | claimed |
| CN-118904910-A | Copper-aluminum-copper composite board with high yield and high elongation as well as preparation process and application thereof | 广州众山精密科技有限公司 | 2024-11-08 | — | — | CN | claimed |
| WO-2024188003-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | 华为技术有限公司 | 2024-09-19 | — | — | WO | claimed |
| CN-109435371-B | High-strength copper-aluminum-copper composite board and preparation process thereof | 北京科技大学 | 2021-03-23 | — | — | CN | claimed |
| CN-106299732-B | A kind of device and its installation method preventing the outdoor full pre-fabricated dry cable termination fever of 110kV | 国网山东省电力公司烟台供电公司 | 2019-01-22 | — | — | CN | claimed |
| CN-106158114-A | A water-proof moisture-proof wire and cable | 西安永成电子科技有限责任公司 | 2016-11-23 | — | — | CN | claimed |
| CN-106067344-A | This utility model claims a water-proof and damp-proof wearable high temperature electric wire and cable | 西安永成电子科技有限责任公司 | 2016-11-02 | — | — | CN | claimed |
| CN-202434705-U | Aluminum-base copper and aluminum expansion joint with hot-rolled composite copper | ZHEJIANG JINMAO HARDWARE FITTING CO LTD | 2012-09-12 | — | — | CN | claimed |
| CN-102568698-A | Heat treatment method of copper-aluminum-copper cold rolling composite plate for conducting | UNIV SHENYANG TECHNOLOGY | 2012-07-11 | — | — | CN | claimed |
| US-8017436-B1 | Thin substrate fabrication method and structure | AMKOR TECHNOLOGY, INC. (US) | 2011-09-13 | — | — | US | claimed |
| EP-0926266-B1 | Method and composition for etching of Al-Cu layers to form electronic circuits | FORD MOTOR CO (US) | 2002-10-16 | — | — | EP | claimed |
| EP-0926266-A1 | Method and composition for etching of Al-Cu layers to form electronic circuits | Ford Motor Company (US) | 1999-06-30 | — | — | EP | claimed |
| EP-0926267-A1 | Method and composition for etching tri-metal layers to form electronic circuits | Ford Motor Company (US) | 1999-06-30 | — | — | EP | claimed |