⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methamidophos SCHEMBL12875554 | 0.97 | — | — | |
| Methamidophos SCHEMBL9498901 | 0.97 | — | — | |
| Methamidophos SCHEMBL23291 | 0.97 | — | — | |
| Methamidophos SCHEMBL9779920 | 0.97 | — | — | |
| Methamidophos SCHEMBL10564282 | 0.97 | — | — | |
| Methamidophos SCHEMBL5354243 | 0.97 | — | — | |
| Methamidophos SCHEMBL10622099 | 0.97 | — | — | |
| Methamidophos SCHEMBL9654823 | 0.97 | — | — | |
| Methamidophos SCHEMBL7374150 | 0.94 | — | — | |
| Methamidophos SCHEMBL7581454 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023094361-A1 | EPOXY RESIN COMPOSITION WITH ADJUSTABLE CURING SPEED AT DIFFERENT TEMPERATURES | SIKA TECHNOLOGY AG (CH) | 2023-06-01 | — | — | WO | claimed |
| EP-4186938-A1 | EPOXY RESIN COMPOSITION HAVING ADJUSTABLE CURING RATE AT DIFFERENT TEMPERATURES | Sika Technology AG (CH) | 2023-05-31 | — | — | EP | claimed |
| CN-110650988-B | Heat-curable epoxy resin adhesive | SIKA技术股份公司 | 2022-10-14 | — | — | CN | claimed |
| CN-111032719-B | Three-component composition for making floor primer or primer | SIKA技术股份公司 | 2022-08-16 | — | — | CN | claimed |
| EP-3673001-B1 | THREE COMPONENT COMPOSITION FOR THE MANUFACTURE OF PRIMER LAYER OR SCRATCH COATING FOR FLOORING | SIKA TECH AG (CH) | 2022-04-27 | — | — | EP | claimed |
| EP-3630866-B1 | THERMOSETTING EPOXY ADHESIVES | SIKA TECH AG (CH) | 2021-12-08 | — | — | EP | claimed |
| US-20210078904-A1 | THREE COMPONENT COMPOSITION FOR THE MANUFACTURE OF PRIMER LAYER OR SCRATCH COATING FOR FLOORING | SIKA TECHNOLOGY AG (CH) | 2021-03-18 | — | — | US | claimed |
| EP-3673001-A1 | THREE COMPONENT COMPOSITION FOR THE MANUFACTURE OF PRIMER LAYER OR SCRATCH COATING FOR FLOORING | Sika Technology AG (CH) | 2020-07-01 | — | — | EP | claimed |
| US-20200190252-A1 | HEAT-CURING EPOXY RESIN ADHESIVES | SIKA TECHNOLOGY AG (CH) | 2020-06-18 | — | — | US | claimed |
| CN-111032719-A | Three-component composition for making floor primer or primer | SIKA技术股份公司 | 2020-04-17 | — | — | CN | claimed |
| EP-3630866-A1 | HEAT-CURING EPOXY RESIN ADHESIVES | Sika Technology AG (CH) | 2020-04-08 | — | — | EP | claimed |
| CN-110650988-A | Heat-curable epoxy resin adhesive | SIKA技术股份公司 | 2020-01-03 | — | — | CN | claimed |
| WO-2019038340-A1 | THREE COMPONENT COMPOSITION FOR THE MANUFACTURE OF PRIMER LAYER OR SCRATCH COATING FOR FLOORING | SIKA TECHNOLOGY AG (CH) | 2019-02-28 | — | — | WO | claimed |
| WO-2023094361-A1 | EPOXY RESIN COMPOSITION WITH ADJUSTABLE CURING SPEED AT DIFFERENT TEMPERATURES | SIKA TECHNOLOGY AG (CH) | 2023-06-01 | — | — | WO | disclosed |
| WO-2023094361-A1 | EPOXY RESIN COMPOSITION WITH ADJUSTABLE CURING SPEED AT DIFFERENT TEMPERATURES | SIKA TECHNOLOGY AG (CH) | 2023-06-01 | — | — | WO | disclosed |
| EP-4186938-A1 | EPOXY RESIN COMPOSITION HAVING ADJUSTABLE CURING RATE AT DIFFERENT TEMPERATURES | Sika Technology AG (CH) | 2023-05-31 | — | — | EP | disclosed |
| CN-111032719-A | Three-component composition for making floor primer or primer | SIKA技术股份公司 | 2020-04-17 | — | — | CN | disclosed |
| EP-3630866-A1 | HEAT-CURING EPOXY RESIN ADHESIVES | Sika Technology AG (CH) | 2020-04-08 | — | — | EP | disclosed |
| CN-110650988-A | Heat-curable epoxy resin adhesive | SIKA技术股份公司 | 2020-01-03 | — | — | CN | disclosed |
| WO-2019038340-A1 | THREE COMPONENT COMPOSITION FOR THE MANUFACTURE OF PRIMER LAYER OR SCRATCH COATING FOR FLOORING | SIKA TECHNOLOGY AG (CH) | 2019-02-28 | — | — | WO | disclosed |