Known targets — ChEMBL curated mechanism
ACHECHRM1CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNG
The experimentally established mechanism targets of Iodide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bromide SCHEMBL28947961 | 0.97 | — | — | |
| Iodide SCHEMBL29025258 | 0.97 | — | — | |
| SCHEMBL231477 | 0.97 | — | — | |
| SCHEMBL251844 | 0.97 | — | — | |
| SCHEMBL24886 | 0.97 | — | — | |
| SCHEMBL2101753 | 0.94 | — | — | |
| Bromide SCHEMBL20815445 | 0.94 | — | — | |
| SCHEMBL17573237 | 0.94 | TSHR (0.45) | — | |
| SCHEMBL20636071 | 0.94 | — | — | |
| Hydrochloric Acid SCHEMBL2861813 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119585073-A | Soldering flux and soldering paste | 千住金属工业株式会社 | 2025-03-07 | — | — | CN | disclosed |
| CN-118055828-B | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-11-19 | — | — | CN | disclosed |
| CN-117377552-B | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-118176083-A | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-118055828-A | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-05-17 | — | — | CN | disclosed |
| EP-4361302-A1 | FLUX AND SOLDER PASTE | Senju Metal Industry Co., Ltd. (JP) | 2024-05-01 | — | — | EP | disclosed |
| EP-4063060-B1 | FLUX AND SOLDER PASTE | SENJU METAL INDUSTRY CO (JP) | 2024-04-24 | — | — | EP | disclosed |
| EP-4063061-B1 | FLUX AND SOLDER PASTE | SENJU METAL INDUSTRY CO (JP) | 2024-04-24 | — | — | EP | disclosed |
| CN-116096528-B | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-04-09 | — | — | CN | disclosed |
| EP-4332257-A1 | FLUX AND SOLDER PASTE | Senju Metal Industry Co., Ltd. (JP) | 2024-03-06 | — | — | EP | disclosed |
| EP-3741498-A1 | FLUX AND SOLDER PASTE | Senju Metal Industry Co., Ltd (JP) | 2020-11-25 | — | — | EP | disclosed |
| US-10843298-B2 | Flux and solder paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-11-24 | — | — | US | disclosed |
| CN-109641324-B | Flux for resin core solder, flux for flux sheath solder, resin core solder, and flux sheath solder | 千住金属工业株式会社 | 2020-09-25 | — | — | CN | disclosed |
| CN-111655421-A | Flux and solder paste | 千住金属工业株式会社 | 2020-09-11 | — | — | CN | disclosed |
| EP-3698913-A1 | FLUX AND RESIN COMPOSITION FOR FLUX | Senju Metal Industry Co., Ltd (JP) | 2020-08-26 | — | — | EP | disclosed |
| EP-3683005-A1 | FLUX AND SOLDER PASTE | Senju Metal Industry Co., Ltd (JP) | 2020-07-22 | — | — | EP | disclosed |
| US-10688603-B2 | Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder, and flux coated solder | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-06-23 | — | — | US | disclosed |
| WO-2020085333-A1 | FLUX AND SOLDER PASTE | 千住金属工業株式会社 | 2020-04-30 | — | — | WO | disclosed |
| US-10556299-B2 | Flux and resin composition for flux | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-02-11 | — | — | US | disclosed |
| EP-3456460-A1 | FLUX FOR RESIN FLUX CORED SOLDERS, FLUX FOR FLUX COATED SOLDERS, RESIN FLUX CORED SOLDER AND FLUX COATED SOLDER | Senju Metal Industry Co., Ltd (JP) | 2019-03-20 | — | — | EP | disclosed |