SCHEMBL208935

SCHEMBL208935

CC(=CCC(F)(F)C(F)(F)C(F)F)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3098416 1.00
SCHEMBL1733416 0.89 KDM4E (0.31)
SCHEMBL1005512 0.89 KDM4E (0.31)
SCHEMBL5529394 0.88 TSHR (0.34)
SCHEMBL5526631 0.86 USP2 (0.36)
SCHEMBL1005482 0.86 USP2 (0.36)
SCHEMBL15754814 0.86 USP2 (0.36)
SCHEMBL2976488 0.86 USP2 (0.36)
SCHEMBL9189395 0.86 USP2 (0.36)
SCHEMBL2968323 0.86 USP2 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8133960-B2 Biomedical devices BAUSCH & LOMB INCORPORATED (US) 2012-03-13 US claimed
US-20090173643-A1 Packaging Solutions LAI YU-CHIN 2009-07-09 US claimed
US-20090156708-A1 BIOMEDICAL DEVICES SOLTA MEDICAL IRELAND LIMITED (IE) 2009-06-18 US claimed
US-6610278-B2 Hardness not greater than 75 as measured by an Asker rubber-hardness tester type C1L; a porosity of at least 0.4; and an impact resistance of at least 5; excellent skin feel upon use and is not easily broken. KAO CORPORATION (JP) 2003-08-26 US claimed
US-20020028220-A1 POWDER-BASED SOLID COSMETIC COMPOSITION AND PREPARATION PROCESS THEREOF KAO CORPORATION (JP) 2002-03-07 US claimed
US-20230411335-A1 THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT KYOCERA CORPORATION (JP) 2023-12-21 US disclosed
US-11784153-B2 Thermosetting resin composition, semiconductor device, and electrical/electronic component KYOCERA CORPORATION (JP) 2023-10-10 US disclosed
EP-3178856-B1 COMPOSITION FOR THE PRODUCTION OF PRESSURE-SENSITIVE ADHESIVES TESA SE (DE) 2020-03-25 EP disclosed
EP-3128540-B1 THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT KYOCERA CORP (JP) 2019-06-12 EP disclosed
US-9868846-B2 Curable composition for imprints, patterning method and pattern FUJIFILM CORPORATION (JP) 2018-01-16 US disclosed
EP-3178856-A1 COMPOSITION FOR THE PRODUCTION OF PRESSURE-SENSITIVE ADHESIVES tesa SE (DE) 2017-06-14 EP disclosed
EP-3128540-A1 THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT KYOCERA Corporation (JP) 2017-02-08 EP disclosed
EP-0968705-B1 Powder-based solid cosmetic composition and preparation process thereof KAO CORP (JP) 2004-01-28 EP disclosed
US-6610278-B2 Hardness not greater than 75 as measured by an Asker rubber-hardness tester type C1L; a porosity of at least 0.4; and an impact resistance of at least 5; excellent skin feel upon use and is not easily broken. KAO CORPORATION (JP) 2003-08-26 US disclosed
EP-0898972-B1 Soft intraocular lens material MENICON CO LTD (JP) 2003-04-09 EP disclosed
US-20020028220-A1 POWDER-BASED SOLID COSMETIC COMPOSITION AND PREPARATION PROCESS THEREOF KAO CORPORATION (JP) 2002-03-07 US disclosed
US-6140438-A FLEXIBLE, ACRYLIC POLYMER COMPRISING CROSSLINKABLE MONOMER UNITS, AROMATIC (METH)ACRYLATE UNITS, ALKYL (METH)ACRYLATE UNITS AND HYDROPHILIC UNITS INCLUDING HYDROXYALKYL ACRYLATE, (METH)ACRYLAMIDES, AND/OR N-VINYL LACTAMS; HAZE-FREE IMPLANTS MENICON CO., LTD. (JP) 2000-10-31 US disclosed
EP-0968705-A1 Powder-based solid cosmetic composition and preparation process thereof Kao Corporation (JP) 2000-01-05 EP disclosed
EP-0898972-A2 Soft intraocular lens material Menicon Co., Ltd. (JP) 1999-03-03 EP disclosed
US-5519070-A FLUORINE, ALKOXY POLYSILOXANE COPOLYMERS FOR INTRAOCULAR LENSES MENICON CO., LTD. (JP) 1996-05-21 US disclosed