SCHEMBL2099986

SCHEMBL2099986

CCN(CC)CC=C[SiH2]Cl

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2101274 0.76
SCHEMBL2977598 0.74 KCNH2 (0.35) KCNH2
SCHEMBL2977599 0.74 KCNH2 (0.35) KCNH2
SCHEMBL2104465 0.74
SCHEMBL2102782 0.73 KCNH2 (0.31) KCNH2
Bromide SCHEMBL8751675 0.72 KCNH2 (0.34) KCNH2
SCHEMBL2269325 0.72 KCNH2 (0.32) KCNH2
SCHEMBL2769515 0.69 TDP1 (0.44) KCNH2
SCHEMBL2769513 0.69 TDP1 (0.44) KCNH2
SCHEMBL12841313 0.67 KCNH2 (0.32) KCNH2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed