⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2100159 | 0.74 | — | — | |
| SCHEMBL2269485 | 0.73 | — | — | |
| SCHEMBL2104091 | 0.73 | — | — | |
| SCHEMBL2269871 | 0.73 | — | — | |
| SCHEMBL27131234 | 0.73 | — | — | |
| SCHEMBL2100936 | 0.73 | — | — | |
| SCHEMBL627752 | 0.69 | — | — | |
| SCHEMBL6450406 | 0.69 | TSHR (0.33) | — | |
| SCHEMBL11203414 | 0.69 | — | — | |
| SCHEMBL2272460 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10658296-B2 | Dielectric film for semiconductor fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2020-05-19 | — | — | US | claimed |
| US-20190035673-A1 | FLOWABLE DIELECTRICS FROM VAPOR PHASE PRECURSORS | INTEL CORP (US) | 2019-01-31 | — | — | US | claimed |
| US-20180096936-A1 | Dielectric Film For Semiconductor Fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2018-04-05 | — | — | US | claimed |
| WO-2017171817-A1 | FLOWABLE DIELECTRICS FROM VAPOR PHASE PRECURSORS | INTEL CORPORATION (US) | 2017-10-05 | — | — | WO | claimed |
| US-11901295-B2 | Dielectric film for semiconductor fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-02-13 | — | — | US | disclosed |
| US-20240030026-A1 | PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM | Kokusai Electric Corporation (JP) | 2024-01-25 | — | — | US | disclosed |
| WO-2022264430-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM | 株式会社KOKUSAI ELECTRIC | 2022-12-22 | — | — | WO | disclosed |
| US-20220223528-A1 | Dielectric Film for Semiconductor Fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-07-14 | — | — | US | disclosed |
| US-11296027-B2 | Dielectric film for semiconductor fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-04-05 | — | — | US | disclosed |
| US-11152306-B2 | Dielectric film for semiconductor fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2021-10-19 | — | — | US | disclosed |
| US-10658296-B2 | Dielectric film for semiconductor fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2020-05-19 | — | — | US | disclosed |
| US-20200083168-A1 | Dielectric Film for Semiconductor Fabrication | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2020-03-12 | — | — | US | disclosed |
| EP-1630249-A2 | Process for chemical vapor deposition of silicon nitride. | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2006-03-01 | — | — | EP | disclosed |
| WO-2006014471-A1 | SILICON NITRIDE FILM WITH STRESS CONTROL | APPLIED MATERIALS, INC. (US) | 2006-02-09 | — | — | WO | disclosed |
| US-20060009041-A1 | Silicon nitride film with stress control | APPLIED MATERIALS, INC. | 2006-01-12 | — | — | US | disclosed |
| EP-0228095-B1 | PROCESS FOR THE PREPARATION OF OLEFINIC SILANES AND SILOXANES | UNION CARBIDE CORPORATION (US) | 1992-01-22 | — | — | EP | disclosed |
| US-4780554-A | O-silylated ketene acetals and enol ethers and method of preparation | UNION CARBIDE CORPORATION (US) | 1988-10-25 | — | — | US | disclosed |
| EP-0228095-A2 | Process for the preparation of olefinic silanes and siloxanes | UNION CARBIDE CORPORATION (US) | 1987-07-08 | — | — | EP | disclosed |
| US-4668812-A | Process for the preparation of olefinic silanes and siloxanes | UNION CARBIDE CORPORATION (US) | 1987-05-26 | — | — | US | disclosed |
| EP-0184692-A1 | Method of preparation of o-silylated ketene acetals and enol ethers | UNION CARBIDE CORPORATION (US) | 1986-06-18 | — | — | EP | disclosed |