SCHEMBL2104076

SCHEMBL2104076

CN(C)C=C([SiH3])N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19139832 0.69
SCHEMBL20808177 0.65
SCHEMBL2269218 0.63
SCHEMBL13853985 0.62
SCHEMBL2181126 0.62
SCHEMBL358911 0.61
SCHEMBL9468767 0.60
SCHEMBL9468764 0.60
SCHEMBL2727302 0.60
SCHEMBL11874159 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2463404-B1 METHOD FOR FORMING SIO2 FILM VERSUM MAT US LLC (US) 2019-10-23 EP claimed
US-20140065844-A1 Amino Vinylsilane Precursors for Stressed SiN Films VERSUM MATERIALS US, LLC 2014-03-06 US claimed
US-8460753-B2 Methods for depositing silicon dioxide or silicon oxide films using aminovinylsilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-06-11 US claimed
EP-2192207-B1 Method using amino vinylsilane precursors for the deposition of intrinsically compressively stressed SiN films AIR PROD & CHEM (US) 2012-06-20 EP claimed
EP-2463404-B1 METHOD FOR FORMING SIO2 FILM VERSUM MAT US LLC (US) 2019-10-23 EP disclosed
US-20140065844-A1 Amino Vinylsilane Precursors for Stressed SiN Films VERSUM MATERIALS US, LLC 2014-03-06 US disclosed
US-8580993-B2 Amino vinylsilane precursors for stressed SiN films AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-11-12 US disclosed
US-8460753-B2 Methods for depositing silicon dioxide or silicon oxide films using aminovinylsilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-06-11 US disclosed
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
EP-2192207-B1 Method using amino vinylsilane precursors for the deposition of intrinsically compressively stressed SiN films AIR PROD & CHEM (US) 2012-06-20 EP disclosed
EP-2465861-A1 Amino vinylsilane precursors for compressively stressed SiN films Air Products and Chemicals, Inc. (US) 2012-06-20 EP disclosed
US-20120148745-A1 Aminovinylsilane for CVD and ALD SiO2 Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-06-14 US disclosed
EP-2463404-A1 Aminovinylsilane for cvd and ald sio2 films Air Products and Chemicals, Inc. (US) 2012-06-13 EP disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
EP-2192207-A1 Amino vinylsilane precursors for the deposition of intrinsically compressively stressed SiN films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-06-02 EP disclosed
US-20100120262-A1 Amino Vinylsilane Precursors for Stressed SiN Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-05-13 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed