SCHEMBL2104191

SCHEMBL2104191

Br[Ta](Br)(Br)Br

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11743934 0.61
SCHEMBL19096 0.58
SCHEMBL7698880 0.50
SCHEMBL247606 0.50
Methane SCHEMBL27782177 0.50
SCHEMBL180757 0.50
SCHEMBL1130910 0.50
SCHEMBL460001 0.50
SCHEMBL11569584 0.50
SCHEMBL15366348 0.45

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112239860-B Method for forming transition metal dichalcogenide film on substrate 三星电子株式会社 2025-01-10 CN claimed
CN-116180028-B Strong and wear-resistant gradient metal ceramic composite multilayer coating and preparation method thereof 吉林大学 2024-11-22 CN claimed
US-11881399-B2 Method of forming transition metal dichalcogenide thin film SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-01-23 US claimed
CN-116180028-A Strong and wear-resistant gradient metal ceramic composite multilayer coating and preparation method thereof 吉林大学 2023-05-30 CN claimed
US-11476117-B2 Method of forming transition metal dichalcogenide thin film SAMSUNG ELECTRONICS CO., LTD. (KR) 2022-10-18 US claimed
US-12297532-B2 Metal chalcogenide film and method and device for manufacturing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-05-13 US disclosed
US-20250027196-A1 METHOD OF FORMING ALLOY THIN FILM USING ATOMIC LAYER DEPOSITION PROCESS INCLUDING OPTIMAL UNIT PROCESS, AND ELECTRONIC ELEMENT MANUFACTURED USING THE SAME INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS (KR) 2025-01-23 US disclosed
CN-112239860-B Method for forming transition metal dichalcogenide film on substrate 三星电子株式会社 2025-01-10 CN disclosed
US-20240420998-A1 Reduction of Air Gaps in FinFET Structures APPLIED MATERIAL, INC. (US) 2024-12-19 US disclosed
WO-2024258830-A1 REDUCTION OF AIR GAPS IN FINFET STRUCTURES APPLIED MATERIALS, INC. (US) 2024-12-19 WO disclosed
CN-116180028-B Strong and wear-resistant gradient metal ceramic composite multilayer coating and preparation method thereof 吉林大学 2024-11-22 CN disclosed
EP-4325210-A1 COMPOSITION, STABILIZATION METHOD, METHOD FOR MEASURING AMOUNT OF LUMINESCENCE, AND STABILIZER FOR LUMINESCENT SUBSTRATE FUJIFILM Corporation (JP) 2024-02-21 EP disclosed
WO-2022138753-A1 NEGATIVE ELECTRODE FOR ALL-SOLID-STATE BATTERY, ALL-SOLID-STATE BATTERY, AND NEGATIVE-ELECTRODE ACTIVE MATERIAL FOR ALL-SOLID-STATE BATTERY 昭和電工マテリアルズ株式会社 2022-06-30 WO disclosed
EP-2250146-B1 PROCESSES FOR PRODUCING TRANSITION METAL AMIDO AND IMIDO COMPOUNDS ALBEMARLE CORP (US) 2014-05-07 EP disclosed
US-8163948-B2 Processes for producing transition metal amido and imido compounds ALBEMARLE CORPORATION (US) 2012-04-24 US disclosed
WO-2009108930-A9 PROCESSES FOR PRODUCING TRANSITION METAL AMIDO AND IMIDO COMPOUNDS ALBEMARLE CORPORATION (US) 2011-08-11 WO disclosed
US-20100331562-A1 PROCESSES FOR PRODUCING TRANSITION METAL AMIDO AND IMIDO COMPOUNDS ALBEMARLE CORPORATION (US) 2010-12-30 US disclosed
EP-2250146-A1 PROCESSES FOR PRODUCING TRANSITION METAL AMIDO AND IMIDO COMPOUNDS Albemarle Corporation (US) 2010-11-17 EP disclosed
US-20090242414-A1 ELECTRONCHEMICAL DEPOSITION OF TANTALUM AND/OR COPPER IN IONIC LIQUIDS MERCK PATENT GMBH (DE) 2009-10-01 US disclosed
WO-2009108930-A1 PROCESSES FOR PRODUCING TRANSITION METAL AMIDO AND IMIDO COMPOUNDS ALBEMARLE CORPORATION (US) 2009-09-03 WO disclosed