SCHEMBL21044846

SCHEMBL21044846

CC=CCCCCCC=CC=CCCCC

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FASN P49327 1/20 0.55
ALDH1A1 P00352 1/20 0.52
TSHR P16473 1/20 0.52
F7 P08709 2/20 0.48
F3 P13726 2/20 0.48
FAAH O00519 6/20 0.46
KDM4E B2RXH2 1/20 0.46
TRPV1 Q8NER1 1/20 0.44
TERT O14746 3/20 0.43
CYP1A2 P05177 2/20 0.43
MAPT P10636 2/20 0.43
CYP2C19 P33261 2/20 0.43
BLM P54132 2/20 0.43
HSD17B10 Q99714 2/20 0.43
FABP4 P15090 2/20 0.43
PTPN1 P18031 2/20 0.43
PPARG P37231 2/20 0.43
KMT2A Q03164 2/20 0.43
PPARD Q03181 2/20 0.43
PPARA Q07869 2/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29553091 0.95 FASN (0.61) FASNALDH1A1TSHRF7F3
SCHEMBL28014712 0.95 FASN (0.61) FASNALDH1A1TSHRF7F3
SCHEMBL28161726 0.93 FASN (0.59) FASNALDH1A1TSHRF7F3
SCHEMBL28640772 0.92 TSHR (0.48) FASNALDH1A1TSHRF7F3
SCHEMBL15466332 0.90 F7 (0.58) F7F3FAAHTRPV1TERT
SCHEMBL9618438 0.90 F7 (0.58) F7F3FAAHTRPV1TERT
SCHEMBL3053208 0.90 F7 (0.58) F7F3FAAHTRPV1TERT
SCHEMBL9618436 0.90 F7 (0.58) F7F3FAAHTRPV1TERT
SCHEMBL3053210 0.90 F7 (0.58) F7F3FAAHTRPV1TERT
SCHEMBL19643083 0.90 F7 (0.58) F7F3FAAHTRPV1TERT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11845882-B2 Multilayer structure, resin composition for adhesive resin layer, and multilayer structure production method MITSUBISHI CHEMICAL CORPORATION (JP) 2023-12-19 US disclosed
US-20190194504-A1 MULTILAYER STRUCTURE, RESIN COMPOSITION FOR ADHESIVE RESIN LAYER, AND MULTILAYER STRUCTURE PRODUCTION METHOD THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. (JP) 2019-06-27 US disclosed
EP-3492261-A1 MULTILAYER STRUCTURE, RESIN COMPOSITION FOR ADHESIVE RESIN LAYERS, AND METHOD FOR PRODUCING MULTILAYER STRUCTURE The Nippon Synthetic Chemical Industry Co., Ltd. (JP) 2019-06-05 EP disclosed
CN-108129680-A A kind of polyolefin packaging adhesive film and solar cell and its preparation method and application 比亚迪股份有限公司 2018-06-08 CN disclosed