SCHEMBL21044875

SCHEMBL21044875

O=Cc1ccc2ccccc2c1N=O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ERN1 O75460 1/20 0.43
POLB P06746 2/20 0.42
PTPN1 P18031 2/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
CYP2A6 P11509 3/20 0.41
TDP1 Q9NUW8 2/20 0.41
ALDH1A1 P00352 1/20 0.41
TSHR P16473 1/20 0.41
HSD17B10 Q99714 1/20 0.41
THRB P10828 2/20 0.39
LMNA P02545 1/20 0.39
BLM P54132 1/20 0.39
HSP90AA1 P07900 1/20 0.38
KDM4E B2RXH2 1/20 0.38
NPC1 O15118 1/20 0.38
HTT P42858 1/20 0.38
HPRT1 P00492 1/20 0.38
CYP3A4 P08684 1/20 0.37
CYP1A2 P05177 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7191223 0.80 POLB (0.40) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL29564098 0.79 POLB (0.39) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL22946872 0.79 POLB (0.39) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL7192787 0.79 TDP1 (0.47) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL7190623 0.78 CDC25B (0.39) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL29521593 0.75 DNMT1 (0.48) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL7643518 0.75 DNMT1 (0.48) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL7545383 0.75 MAPT (0.45) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL31663413 0.74 ERN1 (0.62) ERN1POLBPTPN1MEN1KMT2A
SCHEMBL197337 0.74 ERN1 (0.62) ERN1POLBPTPN1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11860538-B2 Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device FUJIFILM CORPORATION (JP) 2024-01-02 US disclosed
US-20230219280-A1 METHOD FOR PRODUCING COMPOSITION FOR FORMING IMPRINT PATTERN, METHOD FOR PRODUCING CURED SUBSTANCE, IMPRINT PATTERN PRODUCING METHOD, AND METHOD FOR MANUFACTURING DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 US disclosed
US-11567405-B2 Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device FUJIFILM CORPORATION (JP) 2023-01-31 US disclosed
EP-4063953-A1 PATTERN FORMING METHOD, PHOTOCURABLE RESIN COMPOSITION, LAYERED BODY MANUFACTURING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD FUJIFILM Corporation (JP) 2022-09-28 EP disclosed
EP-3940018-A1 CURABLE RESIN COMPOSITION, CURED FILM, LAYERED BODY, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR FUJIFILM Corporation (JP) 2022-01-19 EP disclosed
US-20220002488-A1 CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR FUJIFILM CORPORATION (JP) 2022-01-06 US disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
EP-3859447-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2021-08-04 EP disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3633455-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2020-04-08 EP disclosed
US-20200089113-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER PRECURSOR, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2020-03-19 US disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed