⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butane SCHEMBL3294563 | 0.97 | — | — | |
| SCHEMBL124699 | 0.90 | — | — | |
| Butane SCHEMBL3862936 | 0.87 | — | — | |
| SCHEMBL2802140 | 0.87 | — | — | |
| SCHEMBL5961055 | 0.87 | — | — | |
| Hydrochloric Acid SCHEMBL9709522 | 0.87 | — | — | |
| Butane SCHEMBL296815 | 0.83 | — | — | |
| SCHEMBL109023 | 0.83 | — | — | |
| SCHEMBL4305492 | 0.82 | — | — | |
| SCHEMBL1974323 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-6664199-B2 | Coating liquid for forming a silica group coating film having a small dielectric constant | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-12-16 | — | — | US | disclosed |
| US-6649534-B2 | Methods for processing a coating film and for manufacturing a semiconductor element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-11-18 | — | — | US | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6509279-B2 | Methods for processing a coating film and for manufacturing a semiconductor element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-01-21 | — | — | US | disclosed |
| US-20020192981-A1 | Coating liquid for forming a silica group coating film having a small dielectric constant | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-12-19 | — | — | US | disclosed |
| US-20020192977-A1 | Mothods for processing a coating film and for manufacturing a semiconductor element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-12-19 | — | — | US | disclosed |
| US-20020164886-A1 | Method for processing coating film and method for manufacturing semiconductor element with use of the same method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-11-07 | — | — | US | disclosed |
| EP-1255289-A2 | Method for processing a coating film and method for manufacturing a semiconductor element with use of the same method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-11-06 | — | — | EP | disclosed |
| US-20020009791-A1 | Methods for processing a coating film and for manufacturing a semiconductor element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-01-24 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |