SCHEMBL21186512

SCHEMBL21186512

CC(C)c1cnc2cc(CC(C)c3cnc4cc[nH]c4c3)oc2c1

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
▸ BRD4 O60885 1/20 0.34
▸ HDAC6 Q9UBN7 1/20 0.31
▸ APP P05067 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10288701 0.79 BRD4 (0.44) BRD4APP
SCHEMBL22752583 0.75 ESR1 (0.37) HDAC6
SCHEMBL24721331 0.68 BRD4 (0.42) BRD4APP
SCHEMBL22509486 0.67 BRD4 (0.34) BRD4APP
SCHEMBL20215138 0.65 HDAC6 (0.38) HDAC6
SCHEMBL18339611 0.63 HDAC6 (0.37) HDAC6
SCHEMBL18362081 0.63 HDAC6 (0.35) HDAC6
SCHEMBL21186514 0.63 — —
SCHEMBL24721353 0.62 CDK8 (0.50) BRD4
SCHEMBL1170968 0.60 POLB (0.36) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 — — US disclosed
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