SCHEMBL2118754

SCHEMBL2118754

O=C(O)OC(=O)SC(=O)OC(=O)Oc1ccccc1-c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FABP3 P05413 3/20 0.43
FABP7 O15540 2/20 0.43
FABP5 Q01469 2/20 0.43
L3MBTL1 Q9Y468 5/20 0.41
TDP1 Q9NUW8 3/20 0.41
RXRA P19793 1/20 0.38
RXRB P28702 1/20 0.38
RXRG P48443 1/20 0.38
KDM4E B2RXH2 5/20 0.38
SMN1; SMN2 Q16637 3/20 0.38
ALDH1A1 P00352 2/20 0.38
NCOA1 Q15788 1/20 0.37
NCOA3 Q9Y6Q9 1/20 0.37
LMNA P02545 5/20 0.37
MAPK1 P28482 4/20 0.37
HTT P42858 4/20 0.37
GAA P10253 1/20 0.36
ALOX15 P16050 1/20 0.36
TSHR P16473 1/20 0.36
USP2 O75604 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9851911 0.92 FABP3 (0.44) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL3626164 0.87 FABP3 (0.50) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL5553453 0.84 FABP3 (0.48) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL9344538 0.80 FABP3 (0.44) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL1638833 0.80 FABP3 (0.56) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL1083586 0.78 FABP3 (0.43) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL236822 0.77 FABP3 (0.53) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL6431615 0.76 KDM4E (0.51) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL1639323 0.76 FABP3 (0.56) FABP3FABP7FABP5L3MBTL1TDP1
SCHEMBL30563023 0.76 FABP3 (0.56) FABP3FABP7FABP5L3MBTL1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1579272-A4 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS FUJIFILM ELECTRONIC MATERIALS (US) 2008-12-17 EP claimed
US-7018776-B2 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. (US) 2006-03-28 US claimed
EP-1609026-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE FujiFilm Electronic Materials USA, Inc. (US) 2005-12-28 EP claimed
EP-1579272-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS Fujifilm Electronic Materials USA, Inc. (US) 2005-09-28 EP claimed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
WO-2004055593-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
CN-115989457-A Method for producing cured product, method for producing laminate, and method for producing semiconductor device 富士胶片株式会社 2023-04-18 CN disclosed
US-11162005-B2 Pressure-sensitive adhesive composition SHANJIN OPTOELECTRONICS (SUZHOU) CO., LTD. (CN) 2021-11-02 US disclosed
EP-3021330-B1 METHOD OF MANUFACTURING A DOUBLE SIDE CONDUCTIVE FILM LG CHEMICAL LTD (KR) 2020-07-15 EP disclosed
US-20200161658-A1 ACRYLIC BINDER FOR LITHIUM-SULFUR SECONDARY BATTERY CATHODE AND USE THEREOF LG CHEM, LTD. (KR) 2020-05-21 US disclosed
US-10344524-B2 Door frame Cool-It. (US) 2019-07-09 US disclosed
US-20190194955-A1 MODULAR CURBS SHIELD IT SYSTEMS (US) 2019-06-27 US disclosed
US-20180252019-A1 DOOR FRAME Cool-It 2018-09-06 US disclosed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO disclosed
CN-1038676-C Method for synthesizing diphenyl sulfide tetracarboxylic acid CHANGCHUN APPLIED CHEMISTRY (CN) 1998-06-10 CN disclosed
CN-1038676-C Method for synthesizing diphenyl sulfide tetracarboxylic acid CHANGCHUN APPLIED CHEMISTRY (CN) 1998-06-10 CN disclosed
EP-0335595-B1 Thermoplastic polyester resin composition and molded articles produced therefrom MITSUBISHI CHEM IND (JP) 1994-06-08 EP disclosed
CN-1081436-A Method for synthesizing diphenyl sulfide tetracarboxylic acid and derivative CHANGCHUN APPLIED CHEMISTRY (CN) 1994-02-02 CN disclosed
CN-1081436-A Method for synthesizing diphenyl sulfide tetracarboxylic acid and derivative CHANGCHUN APPLIED CHEMISTRY (CN) 1994-02-02 CN disclosed
US-4965302-A DIIMIDE ULTRAVIOLET SCREENING COMPOUND MITSUBISHI KASEI CORPORATION (JP) 1990-10-23 US disclosed