SCHEMBL2138122

SCHEMBL2138122

O=C=C1CC=CC=C1O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4926419 0.82
SCHEMBL4542505 0.77
SCHEMBL3677731 0.77
SCHEMBL4693644 0.74
SCHEMBL8471704 0.73
SCHEMBL10580762 0.73
SCHEMBL9168024 0.73
SCHEMBL2489897 0.72
SCHEMBL239043 0.72
SCHEMBL3301824 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8183983-A None JP disclosed
CN-110590803-B Dihydroartemisinin carbonyl phenol-containing conjugate, reduction product thereof, synthetic method and application 西南大学 2022-03-04 CN disclosed
CN-110772947-A Halogen gas remover, and preparation method, removing device, monitoring method and removing method thereof 日商科莱恩触媒股份有限公司 2020-02-11 CN disclosed
EP-3081612-B1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO LTD (JP) 2018-11-14 EP disclosed
US-9718999-B2 Photocurable composition having adhesive properties CEMEDINE CO., LTD (JP) 2017-08-01 US disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
US-8288040-B2 High voltage electrolyte TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. (US) 2012-10-16 US disclosed
US-7863391-B2 Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane DOW CORNING TORAY COMPANY, LTD. (JP) 2011-01-04 US disclosed
EP-1776395-B1 POLYMERIZATION CATALYSTS, MAIN GROUP COORDINATION COMPOUNDS, PROCESS FOR PREPARING POLYOLEFINS AND POLYOLEFINS BASELL POLYOLEFINE GMBH (DE) 2010-10-13 EP disclosed
EP-1590377-A1 POLYMERIZATION CATALYSTS, ORGANIC TRANSITION METAL COMPOUNDS, PROCESS FOR PREPARING POLYOLEFINS AND POLYOLEFINS Basell Polyolefine GmbH (DE) 2005-11-02 EP disclosed
JP-2005126410-A METHOD FOR PRODUCING 3,3',5,5'-TETRAALKYL-4,4'-BIPHENOL MITSUBISHI CHEMICALS CORP 2005-05-19 JP disclosed
US-20040183215-A1 Electronic device using coating epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 2004-09-23 US disclosed
WO-2004069881-A1 POLYMERIZATION CATALYSTS, ORGANIC TRANSITION METAL COMPOUNDS, PROCESS FOR PREPARING POLYOLEFINS AND POLYOLEFINS BASELL POLYOLEFINE GMBH (DE) 2004-08-19 WO disclosed
US-6004730-A Method of forming an insulating film pattern and photosensitive composition KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-21 US disclosed
US-5962581-A POLYSILANE; IRRADIATING WITH ACTINIC RADIATION; REMOVAL SEGMENTS BY DISSOLVING IN AQUEOUS ALKALINE DEVELOPER KABUSHIKI KAISHA TOSHIBA (JP) 1999-10-05 US disclosed
JP-H08183983-A OVERBASED METAL SALT USEFUL AS ADDITIVE FOR FUEL AND LUBRICANT LUBRIZOL CORP:THE 1996-07-16 JP disclosed
US-4401602-A PRE- AND POSTEMERGENCE HERBICIDES; DESICCANTS; DEFOLIATION; PLANT GROWTH REGULATORS PPG INDUSTRIES, INC. (US) 1983-08-30 US disclosed
US-4365099-A CHELATION OF METALLIC IMPURITIES IN PHENOL WITH RESIN GENERAL ELECTRIC COMPANY (US) 1982-12-21 US disclosed
US-4344789-A Acids and esters of 5-(2-optionally substituted-4-trifluoromethyl-6-optionally substituted phenoxy)-2-nitro, -halo, or-cyano alpha substituted phenyl carboxy oximes, and method of controlling weeds with them PPG INDUSTRIES, INC. (US) 1982-08-17 US disclosed