SCHEMBL2140236

SCHEMBL2140236

[CH2]CC1(C)CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2141050 0.78
SCHEMBL2786215 0.75
SCHEMBL18593003 0.72
SCHEMBL2810021 0.71
SCHEMBL3029843 0.69
SCHEMBL2708067 0.69
SCHEMBL9339560 0.69
SCHEMBL13367175 0.69
SCHEMBL78830 0.69
SCHEMBL9178457 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5140014-A Antibiotics ABBOTT LABORATORIES (US) 1992-08-18 US claimed
WO-2024142769-A1 RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCTS OF THESE 株式会社レゾナック 2024-07-04 WO disclosed
CN-118255944-A Resin composition, composite material, and cured product thereof 株式会社力森诺科 2024-06-28 CN disclosed
CN-118256177-A Composition for forming adhesive layer, laminate, method for producing adhesive layer, method for producing laminate, and method for treating laminate 日铁化学材料株式会社 2024-06-28 CN disclosed
CN-118255947-A (Meth) acrylic acid copolymer and method for producing same 日铁化学材料株式会社 2024-06-28 CN disclosed
US-20240132646-A1 COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN RESONAC CORPORATION (JP) 2024-04-25 US disclosed
US-20240132645-A1 COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN RESONAC CORPORATION (JP) 2024-04-25 US disclosed
US-20240043597-A1 COMPOSITION AND SHEET RESONAC CORPORATION (JP) 2024-02-08 US disclosed
US-20240043648-A1 COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME RESONAC CORPORATION (JP) 2024-02-08 US disclosed
US-20240047230-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2024-02-08 US disclosed
EP-1057859-B1 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR CORP (JP) 2004-05-19 EP disclosed
EP-1312982-A1 RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT JSR Corporation (JP) 2003-05-21 EP disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
US-6399267-B1 COPOLYMER CONTAINING UNSATURATED CARBOXY ACID OR ANHYDRIDE AND MONOMER OF EPOXY CONTAINING ACRYLIC ESTER JSR CORPORATION (JP) 2002-06-04 US disclosed
US-6335143-B1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2002-01-01 US disclosed
US-20010044075-A1 Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element JSR CORPORATION (JP) 2001-11-22 US disclosed
EP-1150165-A1 Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element JSR Corporation (JP) 2001-10-31 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed
EP-0887706-A1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) 1998-12-30 EP disclosed
US-5140014-A Antibiotics ABBOTT LABORATORIES (US) 1992-08-18 US disclosed