Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.57 |
| ▸ | SIGMAR1 | Q99720 | 3/20 | 0.40 |
| ▸ | NAAA | Q02083 | 2/20 | 0.34 |
| ▸ | EPHX1 | P07099 | 2/20 | 0.34 |
| ▸ | LSS | P48449 | 2/20 | 0.33 |
| ▸ | CCR2 | P41597 | 1/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3027364 | 0.98 | CYP1A2 (0.55) | CYP1A2SIGMAR1NAAAEPHX1LSS | |
| SCHEMBL10996093 | 0.94 | CYP1A2 (0.65) | CYP1A2SIGMAR1HTTLMNAMAPK1 | |
| SCHEMBL3031906 | 0.94 | CYP1A2 (0.54) | CYP1A2SIGMAR1NAAAEPHX1LSS | |
| SCHEMBL455412 | 0.92 | CYP1A2 (0.52) | CYP1A2SIGMAR1NAAAEPHX1LSS | |
| SCHEMBL11333473 | 0.92 | CYP1A2 (0.69) | CYP1A2SIGMAR1HTTLMNAMAPK1 | |
| SCHEMBL548259 | 0.90 | CYP1A2 (0.50) | CYP1A2SIGMAR1EPHX1LSSPKM | |
| SCHEMBL144946 | 0.88 | CYP1A2 (0.61) | CYP1A2SIGMAR1HTTLMNAMAPK1 | |
| SCHEMBL9474398 | 0.88 | CYP1A2 (0.56) | CYP1A2SIGMAR1NAAAEPHX1LSS | |
| SCHEMBL8744097 | 0.88 | CYP1A2 (0.48) | CYP1A2SIGMAR1EPHX1LSSPKM | |
| SCHEMBL4921810 | 0.88 | CYP1A2 (0.48) | CYP1A2SIGMAR1EPHX1LSSPKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3778685-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN-COATED METAL FOIL, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Hitachi Chemical Company, Ltd. (JP) | 2021-02-17 | — | — | EP | disclosed |
| US-20210024741-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN-COATED METAL FOIL, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2021-01-28 | — | — | US | disclosed |
| CN-111936538-A | Thermosetting resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and semiconductor package | 日立化成株式会社 | 2020-11-13 | — | — | CN | disclosed |
| WO-2019187135-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN-COATED METAL FOIL, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 日立化成株式会社 | 2019-10-03 | — | — | WO | disclosed |
| WO-2019189811-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN-COATED METAL FOIL, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 日立化成株式会社 | 2019-10-03 | — | — | WO | disclosed |