Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 10/20 | 0.53 |
| ▸ | CA2 | P00918 | 10/20 | 0.53 |
| ▸ | CA9 | Q16790 | 8/20 | 0.53 |
| ▸ | CA12 | O43570 | 3/20 | 0.53 |
| ▸ | CA7 | P43166 | 3/20 | 0.53 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.53 |
| ▸ | CA3 | P07451 | 2/20 | 0.53 |
| ▸ | CA4 | P22748 | 2/20 | 0.53 |
| ▸ | CA6 | P23280 | 2/20 | 0.53 |
| ▸ | CA5A | P35218 | 2/20 | 0.53 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.53 |
| ▸ | RECQL | P46063 | 2/20 | 0.52 |
| ▸ | GLA | P06280 | 1/20 | 0.52 |
| ▸ | HPGD | P15428 | 1/20 | 0.52 |
| ▸ | TSHR | P16473 | 1/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.52 |
| ▸ | BLM | P54132 | 1/20 | 0.52 |
| ▸ | CES2 | O00748 | 1/20 | 0.47 |
| ▸ | FNTA | P49354 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ether SCHEMBL94783 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL432400 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL8497494 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL9489120 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL11792228 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL2036428 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Octadecyl Sulfate SCHEMBL2935713 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL4934142 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL343672 | 1.00 | CA1 (0.53) | CA1CA2CA9CA12CA7 | |
| Ether SCHEMBL11658871 | 0.98 | CA1 (0.52) | CA1CA2CA9CA12CA7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9644280-B2 | Process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath therefore and the alloy obtained therewith | VALMET PLATING S.R.L. (IT) | 2017-05-09 | — | — | US | claimed |
| US-20150354076-A1 | Process for Electrolytically Depositing a Tin- and Rutenium-Based Alloy, the Electrolytic Bath That Permits Said Alloy to Deposit and the Alloy Obtained by Means of Said Process | VALMET PLATING SRL (IT) | 2015-12-10 | — | — | US | claimed |
| EP-2757180-B1 | A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process | VALMET PLATING S R L (IT) | 2015-08-12 | — | — | EP | claimed |
| WO-2014111761-A1 | A PROCESS FOR ELECTROLYTICALLY DEPOSITING A TIN- AND RUTHENIUM-BASED ALLOY, THE ELECTROLYTIC BATH THAT PERMITS SAID ALLOY TO DEPOSIT AND THE ALLOY OBTAINED BY MEANS OF SAID PROCESS | VALMET S.P.A. (IT) | 2014-07-24 | — | — | WO | claimed |
| EP-2757180-A1 | A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process | Valmet S.p.A. (IT) | 2014-07-23 | — | — | EP | claimed |
| EP-4729567-A1 | POLY(VINYL ALCOHOL)-BASED RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLY(VINYL ALCOHOL)-BASED RESIN COMPOSITION | Mitsubishi Chemical Corporation (JP) | 2026-04-22 | — | — | EP | disclosed |
| EP-4674898-A1 | POLYVINYL ALCOHOL-BASED RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLYVINYL ALCOHOL-BASED RESIN COMPOSITION | Mitsubishi Chemical Corporation (JP) | 2026-01-07 | — | — | EP | disclosed |
| EP-4674899-A1 | POLYVINYL ALCOHOL-BASED RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLYVINYL ALCOHOL-BASED RESIN COMPOSITION | Mitsubishi Chemical Corporation (JP) | 2026-01-07 | — | — | EP | disclosed |
| EP-4674900-A1 | POLYVINYL ALCOHOL-BASED RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLYVINYL ALCOHOL-BASED RESIN COMPOSITION | Mitsubishi Chemical Corporation (JP) | 2026-01-07 | — | — | EP | disclosed |
| US-20250353981-A1 | POLYVINYL ALCOHOL RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLYVINYL ALCOHOL RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-11-20 | — | — | US | disclosed |
| US-20250353940-A1 | POLYVINYL ALCOHOL RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLYVINYL ALCOHOL RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-11-20 | — | — | US | disclosed |
| US-20250353982-A1 | POLYVINYL ALCOHOL RESIN FILM, OPTICAL FILM, WATER-SOLUBLE FILM, AND POLYVINYL ALCOHOL RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-11-20 | — | — | US | disclosed |
| US-20090275143-A1 | NANOSTRUCTURE ARRAY AND METHODS OF USE FOR EXPLOSIVE DETECTION | THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHE EDUCATION, ON BEHALF OF THE UNIVERSITY OF NEVADA, | 2009-11-05 | — | — | US | disclosed |
| EP-1001054-B1 | Tin-copper alloy electroplating bath and plating process therewith | UYEMURA C & CO LTD (JP) | 2005-04-20 | — | — | EP | disclosed |
| US-6607653-B1 | Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2003-08-19 | — | — | US | disclosed |
| US-6508927-B2 | Bath contains an inorganic or organic acid or a water-soluble salt thereof, and one or more thioamide compounds or thiol compounds; forms a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts | C. UYEMURA & CO., LTD. (JP) | 2003-01-21 | — | — | US | disclosed |
| US-20020104763-A1 | TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH | C. UYEMURA & CO., LTD. (JP) | 2002-08-08 | — | — | US | disclosed |
| EP-1001054-A2 | Tin-copper alloy electroplating bath and plating process therewith | C. UYEMURA & CO, LTD (JP) | 2000-05-17 | — | — | EP | disclosed |
| US-5618637-A | MAGNETIC LAYER COMPRISING MAGNETIC POWDER DISPERSED WITHIN BINDER RESIN HAVING AMINO- OR AMMONIUM SALT GROUPS; PACKING DENSITY, ORIENTATION | TDK CORPORATION (JP) | 1997-04-08 | — | — | US | disclosed |
| US-3959160-A | PACKAGE; FATTY ALCOHOL, ANIONIC SURFACTANT | WILKINSON SWORD LIMITED (GB) | 1976-05-25 | — | — | US | disclosed |