SCHEMBL21496044

SCHEMBL21496044

SCCCCCCS.SCCCCCS

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 2/20 0.41
HDAC3 O15379 1/20 0.36
HDAC4 P56524 1/20 0.36
HDAC1 Q13547 1/20 0.36
HDAC7 Q8WUI4 1/20 0.36
HDAC2 Q92769 1/20 0.36
HDAC10 Q969S8 1/20 0.36
HDAC11 Q96DB2 1/20 0.36
HDAC8 Q9BY41 1/20 0.36
HDAC6 Q9UBN7 1/20 0.36
HDAC9 Q9UKV0 1/20 0.36
HDAC5 Q9UQL6 1/20 0.36
ENPEP Q07075 1/20 0.33
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33
ALDH1A1 P00352 1/20 0.31
LMNA P02545 1/20 0.31
MAPT P10636 1/20 0.31
BLM P54132 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15936357 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL112542 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL4446414 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL1800767 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL62752 1.00
SCHEMBL964925 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL1801182 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL15135790 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL21383610 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7
SCHEMBL1801782 1.00 FOLH1 (0.41) FOLH1HDAC3HDAC4HDAC1HDAC7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020070984-A1 ROOM-TEMPERATURE-CURABLE RESIN COMPOSITION, COATING AGENT, ADHESIVE, AND SEALING AGENT, AND ARTICLE 信越化学工業株式会社 2020-04-09 WO disclosed
WO-2019202795-A1 ORGANIC SILICON COMPOUND AND PRODUCTION METHOD THEREFOR 信越化学工業株式会社 2019-10-24 WO disclosed