SCHEMBL216153

SCHEMBL216153

C=CC(C)CC=CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3049354 1.00
SCHEMBL216152 1.00
Hydrochloric Acid SCHEMBL10938809 0.95
SCHEMBL15618503 0.80
SCHEMBL5136924 0.78
SCHEMBL29151305 0.77
SCHEMBL10398935 0.77
SCHEMBL14220755 0.76
SCHEMBL465319 0.76
SCHEMBL7918244 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 184 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12637604-B2 Silicon-containing thermally conductive pastes WACKER CHEMIE AG (DE) 2026-05-26 US disclosed
WO-2026099157-A1 CURABLE SILICONE COMPOSITION FOR INCORPORATION AND RELEASE OF ACTIVES WACKER CHEMIE AG (DE) 2026-05-15 WO disclosed
EP-4720166-A1 CURABLE COMPOSITION Wacker Chemie AG (DE) 2026-04-08 EP disclosed
WO-2025103813-A1 CURABLE SILICONE COMPOSITION WACKER CHEMIE AG (DE) 2025-05-22 WO disclosed
US-12290981-B2 3D printing apparatus for layer-by-layer fabrication of objects using layer transfer printing WACKER CHEMIE AG (DE) 2025-05-06 US disclosed
US-20250019585-A1 ALUMINUM-CONTAINING THERMAL PASTES WACKER CHEMIE AG (DE) 2025-01-16 US disclosed
US-20240417582-A1 ELECTRICALLY CONDUCTIVE SILICONE COMPOSITION WITH CARBON NANOTUBES AND CARBON BLACK WACKER CHEMIE AG (DE) 2024-12-19 US disclosed
US-20240399021-A1 ANTIMICROBIAL COMPOSITION AND METHOD FOR MAKING THE SAME WACKER CHEMIE AG (DE) 2024-12-05 US disclosed
WO-2024240355-A1 CURABLE COMPOSITION WACKER CHEMIE AG (DE) 2024-11-28 WO disclosed
EP-4435013-A2 PROCESS FOR PREPARING MULTI- OR DUAL-HEADED COMPOSITIONS USEFUL FOR CHAIN SHUTTLING Dow Global Technologies LLC (US) 2024-09-25 EP disclosed
EP-1077226-B1 Curable Polysiloxane Compositions WACKER CHEMIE GMBH (DE) 2002-01-23 EP disclosed
US-6252028-B1 PLATINUM CATALYST WACKER-CHEMIE GMBH (DE) 2001-06-26 US disclosed
EP-0994159-B1 Curable organopolysiloxane composition WACKER CHEMIE GMBH (DE) 2001-04-04 EP disclosed
EP-1077226-A1 Curable Polysiloxane Compositions Wacker-Chemie GmbH (DE) 2001-02-21 EP disclosed
US-6187890-B1 CROSSLINK BY REACTION OF ALIPHATICALLY UNSATURATED GROUPS WITH SI-BONDED HYDROGEN (HYDROSILYLATION) IN THE PRESENCE OF A CATALYST, TYPICALLY A PLATINUM COMPOUND WACKER-CHEMIE GMBH (DE) 2001-02-13 US disclosed
EP-0982370-B1 Curable polysiloxane compositions WACKER CHEMIE GMBH (DE) 2000-12-20 EP disclosed
EP-0994159-A1 Curable organopolysiloxane composition Wacker-Chemie GmbH (DE) 2000-04-19 EP disclosed
EP-0982370-A1 Curable polysiloxane compositions Wacker-Chemie GmbH (DE) 2000-03-01 EP disclosed
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed