⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL126913 | 1.00 | — | — | |
| SCHEMBL126914 | 1.00 | — | — | |
| SCHEMBL9063910 | 0.92 | — | — | |
| SCHEMBL18600621 | 0.75 | — | — | |
| SCHEMBL2164096 | 0.71 | — | — | |
| SCHEMBL2164098 | 0.71 | — | — | |
| SCHEMBL5173148 | 0.71 | — | — | |
| SCHEMBL13759557 | 0.71 | — | — | |
| SCHEMBL5173146 | 0.71 | — | — | |
| SCHEMBL10742972 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12630753-B2 | Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof | DOW TORAY CO., LTD. (JP) | 2026-05-19 | — | — | US | disclosed |
| US-12509614-B2 | Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same | DOW TORAY CO., LTD. | 2025-12-30 | — | — | US | disclosed |
| US-12503626-B2 | Organopolysiloxane composition for forming pressure sensitive adhesive layer and use of same | DOW TORAY CO., LTD. (JP) | 2025-12-23 | — | — | US | disclosed |
| US-12503630-B2 | Organopolysiloxane composition having pressure-sensitive adhesive layer formation properties, and use of said composition | DOW TORAY CO., LTD. (JP) | 2025-12-23 | — | — | US | disclosed |
| EP-3896137-B1 | SILICONE ADHESIVE COMPOSITION AND USE THEREOF | DOW TORAY CO LTD (JP) | 2025-11-12 | — | — | EP | disclosed |
| US-12415923-B2 | Curable silicone composition and cured product of same | DOW TRAY CO., LTD. (JP) | 2025-09-16 | — | — | US | disclosed |
| EP-4612250-A1 | SILICONE-BASED PRESSURE SENSITIVE ADHESIVE LAYER-FORMING COMPOSITION AND USE THEREOF | Dow Silicones Corporation (US) | 2025-09-10 | — | — | EP | disclosed |
| EP-4612735-A1 | ELECTRONIC ARTICLE HAVING INTERLAYER ADHESIVE LAYER WITH DAMPING/SHOCK-ABSORPTION FUNCTION | Dow Silicones Corporation (US) | 2025-09-10 | — | — | EP | disclosed |
| WO-2025118201-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE LAMINATES | DOW SILICONES CORPORATION (US) | 2025-06-12 | — | — | WO | disclosed |
| WO-2025118200-A1 | CURABLE SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF | DOW SILICONES CORPORATION (US) | 2025-06-12 | — | — | WO | disclosed |
| WO-2021029412-A1 | ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER AND USE OF SAME | ダウ・東レ株式会社 | 2021-02-18 | — | — | WO | disclosed |
| US-20200354615-A1 | CURING-REACTIVE ORGANOPOLYSILOXANE RESIN, PRESSURE-SENSITIVE ADHESIVE COMPOSITION USING SAME, AND USE THEREOF | DOW TORAY CO., LTD. (JP) | 2020-11-12 | — | — | US | disclosed |
| US-20200224069-A1 | ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER AND USE OF SAME | DOW TORAY CO., LTD. (JP) | 2020-07-16 | — | — | US | disclosed |
| WO-2020121939-A1 | PRESSURE-SENSITIVE SILICONE ADHESIVE COMPOSITION AND USE THEREOF | ダウ・東レ株式会社 | 2020-06-18 | — | — | WO | disclosed |
| WO-2020121930-A1 | SILICONE ADHESIVE COMPOSITION AND USE THEREOF | ダウ・東レ株式会社 | 2020-06-18 | — | — | WO | disclosed |
| EP-3650515-A1 | ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER AND USE OF SAME | Dow Corning Toray Co., Ltd. (JP) | 2020-05-13 | — | — | EP | disclosed |
| WO-2020032285-A1 | ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER, AND USE OF SAME | ダウ・東レ株式会社 | 2020-02-13 | — | — | WO | disclosed |
| WO-2020032287-A1 | ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER, AND USE OF SAME | ダウ・東レ株式会社 | 2020-02-13 | — | — | WO | disclosed |
| WO-2020032286-A1 | ORGANOPOLYSILOXANE COMPOSITION FOR FORMING PRESSURE SENSITIVE ADHESIVE LAYER, AND USE OF SAME | ダウ・東レ株式会社 | 2020-02-13 | — | — | WO | disclosed |
| EP-3608383-A1 | CURING-REACTIVE ORGANOPOLYSILOXANE RESIN, PRESSURE-SENSITIVE ADHESIVE COMPOSITION USING SAME, AND USE THEREOF | Dow Toray Co., Ltd. (JP) | 2020-02-12 | — | — | EP | disclosed |