SCHEMBL2167745

SCHEMBL2167745

C=CCC(CC)(CC)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3338528 0.95
SCHEMBL15301669 0.87
SCHEMBL252503 0.84
SCHEMBL15090867 0.81 TSHR (0.31)
SCHEMBL4267082 0.81 TSHR (0.31)
SCHEMBL15302697 0.78 TSHR (0.36)
SCHEMBL15090854 0.78 TSHR (0.36)
SCHEMBL2168935 0.76 TSHR (0.36)
SCHEMBL15302198 0.76 TSHR (0.37)
SCHEMBL15302176 0.74 TSHR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US claimed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US claimed
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US disclosed
US-12252790-B2 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2025-03-18 US disclosed
CN-116234874-B Curable composition 株式会社钟化 2024-07-19 CN disclosed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US disclosed
CN-111760556-B Urokinase adsorbent and preparation method and application thereof 江苏尤里卡生物科技有限公司 2023-06-30 CN disclosed
CN-116234874-A Curable composition 株式会社钟化 2023-06-06 CN disclosed
WO-2022075386-A1 CURABLE COMPOSITION 株式会社カネカ 2022-04-14 WO disclosed
CN-109897141-B Preparation method of high-strength ASA resin for building materials 淮安市博彦土木工程科学研究院有限公司 2021-03-02 CN disclosed
CN-108513626-B Dispersion, coating liquid, and heat-ray shielding film 住友大阪水泥株式会社 2020-05-19 CN disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20090140284-A1 Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin SUMITOMO OSAKA CEMENT CO., LTD. (JP) 2009-06-04 US disclosed
EP-1950239-A1 TRANSPARENT INORGANIC-OXIDE DISPERSION, RESIN COMPOSITION CONTAINING INORGANIC OXIDE PARTICLES, COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT, LUMINESCENT ELEMENT, HARD COAT, OPTICAL FUNCTIONAL FILM, OPTICAL PART, AND PROCESS FOR PRODUCING RESIN COMPOSITION CONTAINING INORGANIC OXIDE PARTICLES SUMITOMO OSAKA CEMENT CO., LTD. (JP) 2008-07-30 EP disclosed
US-7175892-B2 Emulsion and coating liquid and recording medium using the same ASAHI KASEI KABUSHIKI KAISHA (JP) 2007-02-13 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
US-20040115370-A1 Emulsion and coating liquid and recording medium using the same ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-06-17 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed
EP-1380438-A1 EMULSION AND COATING LIQUID AND RECORDING MEDIUM USING THE SAME Asahi Kasei Kabushiki Kaisha (JP) 2004-01-14 EP disclosed
US-4524169-A THERMOPLASTIC RUBBER, SILICATE FILLER, AND AN ORGANOSILICON COMPOUND DEGUSSA AKTIENGESELLSCHAFT (DE) 1985-06-18 US disclosed