⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15302172 | 0.95 | — | — | |
| SCHEMBL251730 | 0.90 | TSHR (0.30) | — | |
| SCHEMBL31443242 | 0.81 | — | — | |
| SCHEMBL5574610 | 0.81 | TSHR (0.31) | — | |
| SCHEMBL15302496 | 0.81 | TSHR (0.31) | — | |
| SCHEMBL5574619 | 0.81 | TSHR (0.31) | — | |
| SCHEMBL13621313 | 0.79 | TSHR (0.30) | — | |
| SCHEMBL13621314 | 0.79 | TSHR (0.30) | — | |
| SCHEMBL15302197 | 0.78 | TSHR (0.36) | — | |
| SCHEMBL15302044 | 0.78 | TSHR (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210163762-A1 | Dispersion Liquid, Coating Liquid, and Heat Ray Shielding Film | SUMITOMO OSAKA CEMENT CO., LTD. (JP) | 2021-06-03 | — | — | US | disclosed |
| CN-108513626-B | Dispersion, coating liquid, and heat-ray shielding film | 住友大阪水泥株式会社 | 2020-05-19 | — | — | CN | disclosed |
| CN-105579123-B | Inorganic particle dispersion, inorganic particle-containing composition, coating film, plastic substrate with coating film, and display device | 住友大阪水泥股份有限公司 | 2020-03-13 | — | — | CN | disclosed |
| CN-107406684-B | Transparent resin composition and heat-ray shielding film | 住友大阪水泥株式会社 | 2020-03-13 | — | — | CN | disclosed |
| US-10472488-B2 | Transparent resin composition and heat ray-shielding film | SUMITOMO OSAKA CEMENT CO., LTD. (JP) | 2019-11-12 | — | — | US | disclosed |
| EP-3176216-B1 | HYDROPHILIC MATERIAL COMPRISING SULFONATE COPOLYMER AND AMINO RESIN | MITSUI CHEMICALS INC (JP) | 2019-04-24 | — | — | EP | disclosed |
| CN-108513626-A | Dispersion liquid, coating fluid and heat ray shielding film | 住友大阪水泥株式会社 | 2018-09-07 | — | — | CN | disclosed |
| US-9994681-B2 | Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same | HENKEL AG & CO. KGAA (DE) | 2018-06-12 | — | — | US | disclosed |
| US-9976050-B2 | Hydrophilic materials including sulfonate copolymer and amino resin | MITSUI CHEMICALS, INC. (JP) | 2018-05-22 | — | — | US | disclosed |
| US-20180057655-A1 | TRANSPARENT RESIN COMPOSITION AND HEAT RAY-SHIELDING FILM | SUMITOMO OSAKA CEMENT CO., LTD. (JP) | 2018-03-01 | — | — | US | disclosed |
| CN-1226752-C | Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof | JSR CORP (JP) | 2005-11-09 | — | — | CN | disclosed |
| EP-1566368-A2 | Glass powder-containing resin composition, transfer film and process for manufacturing a plasma display panel comprising the transfer film | JSR Corporation (JP) | 2005-08-24 | — | — | EP | disclosed |
| CN-1654534-A | Method for manufacturing inorganic powder contained resin composition, transfer film and components for display screen | JSR CORP (JP) | 2005-08-17 | — | — | CN | disclosed |
| US-20050038214-A1 | Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof | MITSUI CHEMICALS, INC. (JP) | 2005-02-17 | — | — | US | disclosed |
| EP-1471540-A1 | COMPOSITION FOR FORMING PHOTOSENSITIVE DIELECTRIC MATERIAL, AND TRANSFER FILM, DIELECTRIC MATERIAL AND ELECTRONIC PARTS USING THE SAME | JSR Corporation (JP) | 2004-10-27 | — | — | EP | disclosed |
| CN-1505820-A | Composition for forming photosensitive dielectric, and decal film, dielectric and electronic component using the same | ������ʱ����ʽ���� | 2004-06-16 | — | — | CN | disclosed |
| US-20040094752-A1 | Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same | JSR CORPORATION (JP) | 2004-05-20 | — | — | US | disclosed |
| EP-1387367-A1 | COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF | JSR Corporation (JP) | 2004-02-04 | — | — | EP | disclosed |
| CN-1455933-A | Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof | JSR CORP (JP) | 2003-11-12 | — | — | CN | disclosed |
| US-20030151032-A1 | Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof | JSR CORPORATION (JP) | 2003-08-14 | — | — | US | disclosed |