SCHEMBL2178186

SCHEMBL2178186

C=C(C)CCS(=O)(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7055702 0.84 APP (0.44)
SCHEMBL6161210 0.82 APP (0.42)
SCHEMBL10421344 0.80 APP (0.41)
SCHEMBL29575860 0.80 APEX1 (0.46)
SCHEMBL2459462 0.78
SCHEMBL536402 0.77 PTGS1 (0.35)
SCHEMBL4917489 0.77
SCHEMBL1893550 0.76
Potassium SCHEMBL9347201 0.75 PTGS1 (0.33)
SCHEMBL9513534 0.75 PTGS1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10662272-B2 Polishing composition for magnetic disk substrate YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2020-05-26 US claimed
US-10577445-B2 Polishing composition for magnetic disk substrate YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2020-03-03 US claimed
US-20190119423-A1 POLISHING COMPOSITION FOR MAGNETIC DISK SUBSTRATE YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2019-04-25 US claimed
US-20190119422-A1 POLISHING COMPOSITION FOR MAGNETIC DISK SUBSTRATE YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2019-04-25 US claimed
JP-11263892-A None JP disclosed
WO-2024150589-A1 METHOD AND DEVICE FOR TREATING WASTEWATER USING REVERSE OSMOSIS MEMBRANE 栗田工業株式会社 2024-07-18 WO disclosed
WO-2024029162-A1 METHOD FOR OPERATING REVERSE OSMOSIS MEMBRANE DEVICE 栗田工業株式会社 2024-02-08 WO disclosed
EP-4317337-A1 POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, AND POLISHING COMPOSITION SET Fujimi Incorporated (JP) 2024-02-07 EP disclosed
WO-2022202688-A1 POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, AND POLISHING COMPOSITION SET 株式会社フジミインコーポレーテッド 2022-09-29 WO disclosed
CN-113993968-A Polishing composition 福吉米株式会社 2022-01-28 CN disclosed
US-11130694-B2 Recovery method for discharged cooling water KURITA WATER INDUSTRIES LTD. (JP) 2021-09-28 US disclosed
US-20210198524-A1 POLISHING COMPOSITION FOR MAGNETIC DISK SUBSTRATE YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2021-07-01 US disclosed
US-20130032571-A1 METHOD FOR MANUFACTURING AN ALUMINOSILICATE GLASS SUBSTRATE FOR HARD DISKS KAO CORPORATION (JP) 2013-02-07 US disclosed
US-20110240594-A1 POLISHING LIQUID COMPOSITION FOR MAGNETIC-DISK SUBSTRATE KAO CORPORATION (JP) 2011-10-06 US disclosed
US-20110203186-A1 POLISHING LIQUID COMPOSITION FOR MAGNETIC DISK SUBSTRATE KAO CORPORATION (JP) 2011-08-25 US disclosed
US-7972398-B2 Polishing composition for glass substrate KAO CORPORATION (JP) 2011-07-05 US disclosed
US-20080006057-A1 Polishing composition for glass substrate KAO CORPORATION 2008-01-10 US disclosed
US-20070145014-A1 Polishing composition for glass substrate KAO CORPORATION 2007-06-28 US disclosed
US-6440856-B1 GOOD FOR CHEMICAL MECHANICAL POLISHING ABRASIVE PARTICLES SUCH AS SILICA AND ALUMINA; POLYMER OR COPOLYMER HAVING AT LEAST ONE GROUP SELECTED FROM THE GROUP CONSISTING OF SULFONIC ACID AND CARBOXYLIC ACID JSR CORPORATION (JP) 2002-08-27 US disclosed
JP-H11263892-A SCALE PREVENTIVE JSR CORP 1999-09-28 JP disclosed