SCHEMBL2178844

SCHEMBL2178844

C=C[SiH2][SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4946850 0.67
SCHEMBL20580834 0.62
SCHEMBL234060 0.59
SCHEMBL9719891 0.59
SCHEMBL710928 0.56
SCHEMBL699971 0.56
SCHEMBL2872531 0.56
SCHEMBL5708003 0.56
SCHEMBL369030 0.56
SCHEMBL688199 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250109223-A1 METHOD FOR PREPARING A ZIEGLER-NATTA CATALYST SYSTEM WITH IMPROVED PERFORMANCE IN PROPYLENE POLYMERIZATION FORMOSA PLASTICS CORP USA (US) 2025-04-03 US claimed
CN-108905883-B Preparation method of Si-C-Si type anionic organosilicon surfactant 江西新嘉懿新材料有限公司 2024-08-27 CN claimed
US-11485642-B2 SiH-free vinyldisilanes DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC (US) 2022-11-01 US claimed
CN-109689569-B SiH-free vinyldisilanes 美国陶氏有机硅公司 2022-05-27 CN claimed
EP-3515864-B1 SIH-FREE VINYLDISILANES DOW SILICONES CORP (US) 2021-10-20 EP claimed
US-20190284055-A1 SiH-Free Vinyldisilanes DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC 2019-09-19 US claimed
EP-3515864-A1 SiH-FREE VINYLDISILANES Dow Silicones Corporation (US) 2019-07-31 EP claimed
CN-109689569-A Vinyl disilane without SiH 美国陶氏有机硅公司 2019-04-26 CN claimed
WO-2018057411-A1 SiH-FREE VINYLDISILANES DOW CORNING CORPORATION (US) 2018-03-29 WO claimed
US-5620934-A PYROLYSIS OF A POLYALKENYLSILANE TO A SILICON CARBIDE CERAMIC HAVING NO FREE CARBON MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1997-04-15 US claimed
EP-0301099-B1 PROCESSES FOR PREPARING ORGANOSILICON COMPOUNDS AND SILICON CARBIDE MITSUI TOATSU CHEMICALS (JP) 1996-11-06 EP claimed
US-4937364-A Crosslinking agent, chemical intermediate SHIN-ETSU CHEMICAL CO., LTD. (JP) 1990-06-26 US claimed
EP-0301099-A1 PROCESSES FOR PREPARING ORGANOSILICON COMPOUNDS AND SILICON CARBIDE MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-02-01 EP claimed
JP-61207391-A None JP disclosed
US-20250239482-A1 FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES INTEL CORP (US) 2025-07-24 US disclosed
US-12300533-B2 Filling openings by combining non-flowable and flowable processes INTEL CORPORATION (US) 2025-05-13 US disclosed
EP-0301099-A1 PROCESSES FOR PREPARING ORGANOSILICON COMPOUNDS AND SILICON CARBIDE MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-02-01 EP disclosed
US-4654408-A POLYSILOXANES END CAPPED WITH VINYL GROUPS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1987-03-31 US disclosed
US-4634615-A DIELECTRICS TYCO ELECTRONICS CORPORATION, A CORPORATION OF PENNSYLVANIA 1987-01-06 US disclosed
JP-S61207391-A PRODUCTION OF TRISILYLETHANE DERIVATIVE COMPOUND SHIN ETSU CHEM CO LTD 1986-09-13 JP disclosed