Phosphine

Phosphine

SCHEMBL21829630

ClCc1ccccn1.P

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7845475 0.97
SCHEMBL215763 0.97
SCHEMBL29375505 0.97
Iodide SCHEMBL125048 0.95
Hydrochloric Acid SCHEMBL28692185 0.95 HRH1 (0.52)
Water SCHEMBL27515724 0.95
Hydrochloric Acid SCHEMBL4139262 0.95
Hydrochloric Acid SCHEMBL57551 0.95
Bromide SCHEMBL28406374 0.95
Iodide SCHEMBL30860168 0.95

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10947415-B2 Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS (US) 2021-03-16 US disclosed
US-20200255690-A1 CHEMICAL MECHANICAL POLISHING OF TUNGSTEN USING A METHOD AND COMPOSITION CONTAINING QUATERNARY PHOSPHONIUM COMPOUNDS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2020-08-13 US disclosed
US-10604678-B1 Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds Rohrn and Haas Electronic Materials CMP Holdings, Inc. (US) 2020-03-31 US disclosed