SCHEMBL21879744

SCHEMBL21879744

C=CC(C)(C)N=C=N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1826666 0.72
SCHEMBL1444777 0.65
Methane SCHEMBL4629718 0.63
SCHEMBL618022 0.61
SCHEMBL1469897 0.61
SCHEMBL4629715 0.57
SCHEMBL388465 0.57
SCHEMBL3137035 0.57
Fluoride SCHEMBL29043543 0.57
SCHEMBL42320 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 123 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120192629-A Resin composition 味之素株式会社 2025-06-24 CN disclosed
CN-120134736-A Resin sheet with metal foil 味之素株式会社 2025-06-13 CN disclosed
CN-120134737-A Resin sheet with metal foil 味之素株式会社 2025-06-13 CN disclosed
CN-120118471-A Resin composition 味之素株式会社 2025-06-10 CN disclosed
CN-120059458-A Resin composition 味之素株式会社 2025-05-30 CN disclosed
CN-120021354-A Method for manufacturing circuit board 味之素株式会社 2025-05-20 CN disclosed
CN-119978708-A Resin sheet and method for producing same, method for producing circuit board, and resin composition 味之素株式会社 2025-05-13 CN disclosed
CN-119993845-A Method for manufacturing circuit board 味之素株式会社 2025-05-13 CN disclosed
CN-119769180-A Method for manufacturing magnetic substrate and magnetic substrate 味之素株式会社 2025-04-04 CN disclosed
CN-119552478-A Resin composition 味之素株式会社 2025-03-04 CN disclosed
CN-111183010-A Mold release film for molding and molding method 东丽薄膜先端加工股份有限公司 2020-05-19 CN disclosed
WO-2020085260-A1 AQUEOUS RESIN COMPOSITION, PRODUCTION METHOD FOR AQUEOUS RESIN COMPOSITION, AND USE FOR AQUEOUS RESIN COMPOSITION 株式会社日本触媒 2020-04-30 WO disclosed
WO-2020085263-A1 AQUEOUS DISPERSION, PRODUCTION METHOD FOR AQUEOUS DISPERSION, AND USE FOR AQUEOUS DISPERSION 株式会社日本触媒 2020-04-30 WO disclosed
CN-104768759-B Mold release film and its manufacture method 尤尼吉可株式会社 2017-10-20 CN disclosed
CN-104395077-B Demoulding biaxially oriented polyester film 尤尼吉可株式会社 2017-06-09 CN disclosed
CN-104768760-B Mold release film and method for producing same 尤尼吉可株式会社 2017-06-09 CN disclosed
CN-106660351-A laminated film 尤尼吉可株式会社 2017-05-10 CN disclosed
CN-104768759-A Mold release film and production method for same UNITIKA LTD 2015-07-08 CN disclosed
CN-104768760-A Mold release film and method for producing same UNITIKA LTD 2015-07-08 CN disclosed
CN-104395077-A Biaxially stretched polyester film for mold release UNITIKA LTD 2015-03-04 CN disclosed