SCHEMBL2189344

SCHEMBL2189344

CC(C)(C)S(=O)(=O)C=[N+]=[N-]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6761948 0.77
SCHEMBL19459563 0.75
SCHEMBL6761674 0.74
SCHEMBL4964988 0.72
SCHEMBL4965555 0.71
SCHEMBL6757901 0.69
SCHEMBL4812492 0.69
SCHEMBL7691561 0.67
SCHEMBL1678555 0.63
SCHEMBL9342138 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 255 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101034260-A Photosensitive resin composition DONGJIN SEMICHEM CO LTD (KR) 2007-09-12 CN claimed
CN-122043858-A EUV patterned resist formation method 亚历克斯·P·G·罗宾逊 2026-05-15 CN disclosed
US-11592605-B2 Color developing structure having concave-convex layer, method for producing such structure, and display TOPPAN PRINTING CO., LTD. (JP) 2023-02-28 US disclosed
CN-110095941-B Photosensitive resin composition and method for producing semiconductor element 东丽株式会社 2023-02-17 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-114975098-A Nanoimprint liquid material, method for producing pattern of cured product, and method for producing circuit board 佳能株式会社 2022-08-30 CN disclosed
CN-107251193-B Nanoimprint liquid material, method for producing pattern of cured product, method for producing optical component, and method for producing circuit board 佳能株式会社 2022-06-21 CN disclosed
US-11332597-B2 Photo-curable composition and patterning method using the same CANON KABUSHIKI KAISHA (JP) 2022-05-17 US disclosed
CN-114460809-A Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-05-10 CN disclosed
CN-109422881-B Epoxy group-containing isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern formation method 信越化学工业株式会社 2022-04-19 CN disclosed
CN-1145078-C Polymer and resist material ������ҩ��ҵ��ʽ���� 2004-04-07 CN disclosed
CN-1432873-A Acid generator, sulfonic acid derivative and radiation-sensitive resin composition JSR CORP (JP) 2003-07-30 CN disclosed
CN-1388414-A Material for preservative formation TOKYO O KAGAKU KOGYO CO LTD (JP) 2003-01-01 CN disclosed
CN-1097073-C Polymer composition and resist meterial WAKO PURE CHEM IND LTD (JP) 2002-12-25 CN disclosed
US-6280900-B1 RADIATION SENSITIVE COMPOSITION WITH ALKALINE DEVELOPER SOLUBLE IN POLYMER COATED ON SUBSTRATE JSR CORPORATION (JP) 2001-08-28 US disclosed
CN-1287630-A Positive radiation-sensitive composition TORAY INDUSTRIES (JP) 2001-03-14 CN disclosed
CN-1278076-A Agent for lowering dependence of substrate WAKO PURE CHEM IND LTD (JP) 2000-12-27 CN disclosed
EP-1059314-A1 A resist composition Wako Pure Chemical Industries, Ltd. (JP) 2000-12-13 EP disclosed
CN-1263611-A Method for forming pattern CLARIANT INT LTD (CH) 2000-08-16 CN disclosed
CN-1159459-A Polymer composition and resist meterial WAKO PURE CHEM IND LTD (JP) 1997-09-17 CN disclosed