SCHEMBL21908583

SCHEMBL21908583

CCCCCCCCCOc1ccc(C(=O)OC)cc1

nearest known ligand 0.74

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 2/20 0.74
▸ TP53 P04637 1/20 0.71
▸ TSHR P16473 1/20 0.71
▸ PLA2G4B P0C869 5/20 0.69
▸ RAB9A P51151 1/20 0.66
▸ RARB P10826 3/20 0.65
▸ NPC1 O15118 2/20 0.62
▸ LMNA P02545 2/20 0.62
▸ NFKB1 P19838 1/20 0.62
▸ NFKB2 Q00653 1/20 0.62
▸ RELA Q04206 1/20 0.62
▸ SMN1; SMN2 Q16637 1/20 0.62
▸ MGLL Q99685 1/20 0.62
▸ PLA2G4A P47712 1/20 0.61
▸ CYP1A2 P05177 1/20 0.60
▸ CYP3A4 P08684 1/20 0.60
▸ CYP2D6 P10635 1/20 0.60
▸ CYP2C9 P11712 1/20 0.60
▸ CYP2C19 P33261 1/20 0.60

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3051371 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL7171003 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL3055019 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL12113908 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL302793 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL3052051 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL2622417 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL3051368 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL8960632 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A
SCHEMBL302596 1.00 MAPT (0.74) MAPTTP53TSHRPLA2G4BRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10752778-B2 Resin composition containing surface-modified inorganic substance, thermally conductive material, and device FUJIFILM CORPORATION (JP) 2020-08-25 — — US disclosed
US-10633252-B2 Surface-modified inorganic substance, method for manufacturing same, resin composition, thermally conductive material, and device FUJIFILM CORPORATION (JP) 2020-04-28 — — US disclosed
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