SCHEMBL2198064

SCHEMBL2198064

O[C]Br

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1332027 0.67
SCHEMBL1332088 0.67
SCHEMBL9944 0.67
SCHEMBL9393662 0.62
Methane SCHEMBL27764219 0.62
Hydrochloric Acid SCHEMBL4257789 0.62
Hydroxyl Radical SCHEMBL928014 0.62
SCHEMBL17607321 0.62
SCHEMBL27780580 0.62
SCHEMBL4597 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9960325-B2 Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same PANASONIC CORPORATION (JP) 2018-05-01 US disclosed
US-20150104657-A1 LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME PANASONIC HOLDINGS CORPORATION (JP) 2015-04-16 US disclosed
US-8946746-B2 Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same PANASONIC CORPORATION (JP) 2015-02-03 US disclosed
US-20110169033-A1 LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME PANASONIC HOLDINGS CORPORATION (JP) 2011-07-14 US disclosed