⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15053557 | 0.80 | — | — | |
| SCHEMBL221635 | 0.80 | — | — | |
| SCHEMBL11152323 | 0.78 | — | — | |
| SCHEMBL49922 | 0.76 | — | — | |
| SCHEMBL23701292 | 0.75 | — | — | |
| SCHEMBL23701450 | 0.75 | — | — | |
| SCHEMBL3344251 | 0.71 | — | — | |
| SCHEMBL228007 | 0.71 | — | — | |
| SCHEMBL5416587 | 0.71 | — | — | |
| SCHEMBL11836060 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1909142-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER | TORAY INDUSTRIES (JP) | 2015-06-24 | — | — | EP | disclosed |
| US-7977028-B2 | Photosensitive resin composition and adhesion promoter | TORAY INDUSTRIES, INC. (JP) | 2011-07-12 | — | — | US | disclosed |
| US-20090123867-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER | TORAY INDUSTRIES, INC. (JP) | 2009-05-14 | — | — | US | disclosed |
| US-20080319121-A1 | Room-Temperature Curable Organopolysiloxane Composition and Electrical or Electronic Devices | DOW CORNING TORAY COMPANY, LTD. (JP) | 2008-12-25 | — | — | US | disclosed |
| EP-1789495-B1 | ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ELECTRICAL OR ELECTRONIC DEVICES | DOW CORNING TORAY CO LTD (JP) | 2008-04-09 | — | — | EP | disclosed |
| EP-1909142-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER | TORAY INDUSTRIES, INC. (JP) | 2008-04-09 | — | — | EP | disclosed |
| EP-1789495-A2 | ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ELECTRICAL OR ELECTRONIC DEVICES | Dow Corning Toray Co., Ltd. (JP) | 2007-05-30 | — | — | EP | disclosed |
| US-7193026-B2 | Organosilicon compound-curing composition and silicone-base coating composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-20 | — | — | US | disclosed |
| WO-2006006371-A2 | ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ELECTRICAL OR ELECTRONIC DEVICES | DOW CORNING TORAY CO., LTD. (JP) | 2006-01-19 | — | — | WO | disclosed |
| US-20040260048-A1 | Organosilicon compound - curing composition and silicone-base coating composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-23 | — | — | US | disclosed |
| US-4267297-A | CONTAINING ALKOXYLATED SILOXANES, ALKOXYSILANES AND AMINOALKOXYSILANES | TORAY SILICONE COMPANY, LTD. (JP) | 1981-05-12 | — | — | US | disclosed |