SCHEMBL22020163

SCHEMBL22020163

O=Cc1cc2ccc3cccc4ccc(c1C(=O)O)c2c34

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.50
MEN1 O00255 4/20 0.50
CYP1A2 P05177 4/20 0.42
ERBB2 P04626 1/20 0.42
FYN P06241 1/20 0.42
MAOA P21397 1/20 0.42
ACHE P22303 1/20 0.42
AHR P35869 1/20 0.42
ALDH1A1 P00352 6/20 0.41
HPGD P15428 5/20 0.41
HSD17B10 Q99714 5/20 0.41
KDM4E B2RXH2 3/20 0.41
GLA P06280 2/20 0.41
POLB P06746 2/20 0.41
CYP2D6 P10635 1/20 0.41
MAPT P10636 2/20 0.40
CYP2C19 P33261 1/20 0.40
L3MBTL1 Q9Y468 2/20 0.37
CYP3A4 P08684 2/20 0.37
TSHR P16473 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL548658 0.84 KMT2A (0.44) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL183076 0.79 KMT2A (0.55) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL28401082 0.79 ERN1 (0.46) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL10562778 0.78 CYP1A2 (0.52) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL3712829 0.78 KMT2A (0.53) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL548370 0.77 CYP1A2 (0.47) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL547987 0.76 KMT2A (0.43) KMT2AMEN1CYP1A2ALDH1A1HPGD
SCHEMBL275486 0.76 KMT2A (0.53) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL5747710 0.76 CYP1A2 (0.46) KMT2AMEN1CYP1A2ERBB2FYN
SCHEMBL548664 0.75 ERN1 (0.36) KMT2AMEN1CYP1A2ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653573-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 EP disclosed