⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL176364 | 0.82 | — | — | |
| SCHEMBL31277021 | 0.82 | — | — | |
| SCHEMBL391978 | 0.82 | — | — | |
| SCHEMBL14797531 | 0.82 | — | — | |
| SCHEMBL197343 | 0.67 | — | — | |
| SCHEMBL21541919 | 0.67 | — | — | |
| SCHEMBL5856568 | 0.67 | — | — | |
| SCHEMBL20572332 | 0.67 | — | — | |
| SCHEMBL22370917 | 0.67 | — | — | |
| Water SCHEMBL16295572 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109346533-A | Wafer level packaging structure of chip and preparation method thereof | 西安赛恒电子科技有限公司 | 2019-02-15 | — | — | CN | claimed |
| US-5508868-A | Dual element magnetoresistive sensing head having in-gap flux guide and flux closure piece with particular connection of magnetoresistive sensing elements to differential amplifier | READ-RITE CORPORATION (US) | 1996-04-16 | — | — | US | claimed |
| CN-221275212-U | Vacuum packaging structure | 浙江大立科技股份有限公司 | 2024-07-05 | — | — | CN | disclosed |
| CN-117069049-A | Vacuum packaging structure and preparation method thereof | 浙江大立科技股份有限公司 | 2023-11-17 | — | — | CN | disclosed |
| CN-112511129-A | Airtight packaging structure of film bulk acoustic resonator and preparation method thereof | 赛莱克斯微系统科技（北京）有限公司 | 2021-03-16 | — | — | CN | disclosed |
| CN-109346533-A | Wafer level packaging structure of chip and preparation method thereof | 西安赛恒电子科技有限公司 | 2019-02-15 | — | — | CN | disclosed |
| EP-1352403-B1 | INTEGRATED TRANSFORMER | INTEL CORP (US) | 2015-06-10 | — | — | EP | disclosed |
| US-7982574-B2 | Integrated transformer | INTEL CORPORATION (US) | 2011-07-19 | — | — | US | disclosed |
| US-20100295649-A1 | INTEGRATED TRANSFORMER | INTEL CORPORATION | 2010-11-25 | — | — | US | disclosed |
| US-7791447-B2 | Integrated transformer | INTEL CORPORATION (US) | 2010-09-07 | — | — | US | disclosed |
| US-20090015363-A1 | INTEGRATED TRANSFORMER | GARDNER DONALD S | 2009-01-15 | — | — | US | disclosed |
| US-20030001713-A1 | Integrated transformer | GARDNER DONALD S (US) | 2003-01-02 | — | — | US | disclosed |
| WO-2002071456-A2 | MAGNETIC LAYER PROCESSING | INTEL CORPORATION (US) | 2002-09-12 | — | — | WO | disclosed |
| WO-2002065492-A2 | INTEGRATED TRANSFORMER | INTEL CORPORATION (US) | 2002-08-22 | — | — | WO | disclosed |
| WO-2002058140-A2 | INTEGRATED INDUCTOR | INTEL CORPORATION (US) | 2002-07-25 | — | — | WO | disclosed |
| US-20020008605-A1 | Integrated transformer | INTEL CORPORATION | 2002-01-24 | — | — | US | disclosed |
| US-20010050607-A1 | Integrated transformer | INTEL CORPORATION | 2001-12-13 | — | — | US | disclosed |
| US-20010031549-A1 | Magnetic layer processing | INTEL CORPORATION | 2001-10-18 | — | — | US | disclosed |
| US-20010030591-A1 | Integrated inductor | INTEL CORPORATION | 2001-10-18 | — | — | US | disclosed |
| US-5508868-A | Dual element magnetoresistive sensing head having in-gap flux guide and flux closure piece with particular connection of magnetoresistive sensing elements to differential amplifier | READ-RITE CORPORATION (US) | 1996-04-16 | — | — | US | disclosed |