⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2208474 | 1.00 | — | — | |
| SCHEMBL7634598 | 0.73 | — | — | |
| SCHEMBL1637286 | 0.73 | — | — | |
| SCHEMBL29078804 | 0.73 | — | — | |
| SCHEMBL7090438 | 0.67 | — | — | |
| SCHEMBL9395220 | 0.67 | — | — | |
| SCHEMBL232833 | 0.67 | — | — | |
| SCHEMBL464995 | 0.67 | — | — | |
| SCHEMBL454568 | 0.65 | — | — | |
| SCHEMBL5014857 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2033985-B1 | Heat-curable polyimide silicone resin composition | SHINETSU CHEMICAL CO (JP) | 2017-04-12 | — | — | EP | disclosed |
| US-20160082699-A1 | RESIN LAYER-ATTACHED SUPPORTING SUBSTRATE AND METHOD FOR PRODUCING SAME, GLASS LAMINATE AND METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-03-24 | — | — | US | disclosed |
| US-20160075110-A1 | FLEXIBLE SUBSTRATE AND METHOD FOR PRODUCING SAME, GLASS LAMINATE AND METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-03-17 | — | — | US | disclosed |
| US-20130237040-A1 | RESIN COMPOSITION, LAMINATE AND PROCESS FOR PRODUCTION THEREOF, STRUCTURE AND PROCESS FOR PRODUCTION THEREOF, AND PROCESS FOR PRODUCTION OF ELECTRONIC DEVICE | ASAHI GLASS COMPANY, LIMITED (JP) | 2013-09-12 | — | — | US | disclosed |
| US-7981976-B2 | Heat-curable polyimide silicone resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-07-19 | — | — | US | disclosed |
| EP-2033985-A2 | Heat-curable polyimide silicone resin composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-03-11 | — | — | EP | disclosed |
| US-20090062480-A1 | Heat-curable polyimide silicone resin composition | SHIN-ETSU CHEMICAL CO., LTD. | 2009-03-05 | — | — | US | disclosed |
| US-7432313-B2 | Solvent-free polymide silicone resin composition and a cured resin film thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-10-07 | — | — | US | disclosed |
| EP-1634907-B1 | Solvent-free polymide silicone resin composition and a cured resin film thereof | SHINETSU CHEMICAL CO (JP) | 2008-03-26 | — | — | EP | disclosed |
| EP-1634907-A1 | Solvent-free polymide silicone resin composition and a cured resin film thereof | Shin-Etsu Chemical Co., Ltd. (JP) | 2006-03-15 | — | — | EP | disclosed |
| US-20060052476-A1 | Solvent-free polymide silicone resin composition and a cured resin film thereof | SHIN-ETSU CHEMICAL CO., LTD. | 2006-03-09 | — | — | US | disclosed |