SCHEMBL22202155

SCHEMBL22202155

C=CCc1ccccc1OC(=O)c1cccc(C(=O)OC)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.53
KMT2A Q03164 4/20 0.53
CYP3A4 P08684 1/20 0.53
TDP1 Q9NUW8 1/20 0.53
L3MBTL1 Q9Y468 1/20 0.53
SLC6A3 Q01959 1/20 0.47
ELANE P08246 1/20 0.46
KDM4E B2RXH2 5/20 0.46
HTT P42858 3/20 0.44
SMN1; SMN2 Q16637 3/20 0.44
MAPT P10636 4/20 0.43
LOXL2 Q9Y4K0 1/20 0.43
PTPN1 P18031 1/20 0.43
CYP4F2 P78329 1/20 0.43
CYP4A11 Q02928 1/20 0.43
TSHR P16473 1/20 0.42
ALDH1A1 P00352 2/20 0.42
RAB9A P51151 3/20 0.42
NPC1 O15118 1/20 0.42
HSP90AA1 P07900 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12227233 0.93 KMT2A (0.52) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL22171637 0.87 KMT2A (0.51) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL22202365 0.87 KMT2A (0.50) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL22171649 0.85 MEN1 (0.45) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL31112624 0.84 KMT2A (0.58) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL4284963 0.84 KMT2A (0.58) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL22171672 0.84 MEN1 (0.53) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL22171678 0.84 MEN1 (0.49) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL22892306 0.84 MEN1 (0.46) MEN1KMT2ACYP3A4TDP1L3MBTL1
SCHEMBL12227226 0.83 KMT2A (0.52) MEN1KMT2ACYP3A4TDP1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11548977-B2 Active ester resin and composition and cured product using the same DIC CORPORATION (JP) 2023-01-10 US disclosed
US-20210009804-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF DIC CORPORATION (JP) 2021-01-14 US disclosed
US-20200216603-A1 ACTIVE ESTER RESIN AND COMPOSITION AND CURED PRODUCT USING THE SAME DIC CORPORATION (JP) 2020-07-09 US disclosed