Tetrafluoroethylene

Tetrafluoroethylene

SCHEMBL2226736

C=COC(F)(F)C(F)=C(F)F.FC(F)=C(F)F

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL718043 0.97
SCHEMBL21243970 0.80
SCHEMBL29245162 0.78
SCHEMBL29245148 0.78
SCHEMBL11135440 0.78
Tetrafluoroethylene SCHEMBL837383 0.76
SCHEMBL8734928 0.76
SCHEMBL28114556 0.75
Tetrafluoroethylene SCHEMBL27830562 0.74
SCHEMBL11229747 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-1153867-A None JP disclosed
US-8888106-B2 Seal plate, seal member that is used in seal plate, and method for manufacturing the same NIPPON VALQUA INDUSTRIES, LTD. (JP) 2014-11-18 US disclosed
EP-2541341-B1 Image forming apparatus KONICA MINOLTA BUSINESS TECH (JP) 2014-06-18 EP disclosed
US-8066146-B2 Insulated container and method of manufacturing the same NICHIAS CORPORATION (JP) 2011-11-29 US disclosed
US-20110169229-A1 Seal Plate, Seal Member that is Used in Seal Plate, and Method for Manufacturing the Same NIPPON VALQUA INDUSTRIES, LTD. (JP) 2011-07-14 US disclosed
EP-1867704-B1 SURFACE TREATMENT METHOD USING DISC-LIKE COMPOUND, (LUBRICATING) COMPOSITION FOR SURFACE TREATMENT, AND SURFACE-TREATED ARTICLE FUJIFILM CORP (JP) 2010-09-15 EP disclosed
US-20090039089-A1 Insulated container and method of manufacturing the same NICHIAS CORPORATION (JP) 2009-02-12 US disclosed
US-7431816-B2 Method of manufacturing heat resistant resin film with metal thin film FUJI XEROX CO., LTD. (JP) 2008-10-07 US disclosed
US-20080134938-A1 Surface Treatment Method Employing Discotic Compound, (Lubricant) Composition to Be Used Surface Treatments, and Surface-Treated Articles FUJIFILM CORPORATION (JP) 2008-06-12 US disclosed
EP-1867704-A1 SURFACE TREATMENT METHOD USING DISC-LIKE COMPOUND, (LUBRICATING) COMPOSITION FOR SURFACE TREATMENT, AND SURFACE-TREATED ARTICLE FUJIFILM Corporation (JP) 2007-12-19 EP disclosed
US-7223717-B2 Thermal transfer image receiving sheet and method for manufacturing the same DAI NIPPON PRINTING CO., LTD. (JP) 2007-05-29 US disclosed
US-20050026779-A1 Thermal transfer image receiving sheet and method for manufacturing the same DAI NIPPON PRINTING CO., LTD. (JP) 2005-02-03 US disclosed
US-20040219376-A1 Heat resistant resin film with metal thin film, manufacturing method of the resin film, endless belt, manufacturing method of the belt, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2004-11-04 US disclosed
US-20020076515-A1 Heat resistant resin film with metal thin film, manufacturing method of the resin film, endless belt, manufacturing method of the belt, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2002-06-20 US disclosed
JP-H01153867-A SELF-LUBRICATING RIDER RING MIKUNI JUKOGYO KK 1989-06-16 JP disclosed
US-4770680-A Wafer carrier for a semiconductor device fabrication, having means for sending clean air stream to the wafers stored therein FUJITSU LIMITED (JP) 1988-09-13 US disclosed
EP-0246587-A1 Wafer carrier for semiconductor device fabrication. FUJITSU LIMITED (JP) 1987-11-25 EP disclosed