SCHEMBL223155

SCHEMBL223155

CCCCCCCCNS(=O)(=O)c1ccccc1C

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RECQL P46063 1/20 0.70
CA12 O43570 3/20 0.62
CA9 Q16790 3/20 0.62
TSHR P16473 3/20 0.59
MEN1 O00255 2/20 0.59
KMT2A Q03164 2/20 0.59
TDP1 Q9NUW8 2/20 0.59
CYP1A2 P05177 2/20 0.59
CYP3A4 P08684 2/20 0.59
CYP2C19 P33261 2/20 0.59
TP53 P04637 1/20 0.59
L3MBTL1 Q9Y468 1/20 0.53
SMN1; SMN2 Q16637 2/20 0.52
HTT P42858 2/20 0.52
POLB P06746 2/20 0.52
F13A1 P00488 1/20 0.51
ALDH1A1 P00352 3/20 0.50
KDM4E B2RXH2 2/20 0.50
LMNA P02545 2/20 0.50
PKM P14618 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL634182 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL7103283 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL635948 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL8355313 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL634179 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL633647 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL31664326 1.00 RECQL (0.70) RECQLCA12CA9TSHRMEN1
SCHEMBL635207 0.98 RECQL (0.68) RECQLCA12CA9TSHRMEN1
SCHEMBL635553 0.93 CA12 (0.63) RECQLCA12CA9TSHRMEN1
SCHEMBL31391062 0.93 CA12 (0.63) RECQLCA12CA9TSHRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114163812-A Low-temperature-resistant high-wear-resistance nylon material and preparation method and application thereof 万华化学(宁波)有限公司 2022-03-11 CN claimed
US-20110217559-A1 JOINING OF MOULDINGS OF DIFFERENT POLYAMIDE COMPOUNDS EVONIK DEGUSSA GMBH (DE) 2011-09-08 US claimed
US-20040202908-A1 Line system for fluids and gases in a fuel cell DEGUSSA AG (DE) 2004-10-14 US claimed
US-4959403-A FROM DECAMETHYLENEDIAMINE AND DODECANEDIOIC ACID, ESTER OR SULFONAMIDE PLASTICIZER HUELS AKTIENGESELLSCHAFT (DE) 1990-09-25 US claimed
US-4904718-A Thermoplastic molding compounds which have impact strength when cold HUELS AKTIENGESELLSCHAFT (DE) 1990-02-27 US claimed
EP-4701848-A1 ON- AND OFFSHORE LONG-CHAIN POLYAMIDE TUBE WITH INCREASED BARRIER EFFECT Evonik Operations GmbH (DE) 2026-03-04 EP disclosed
EP-4363497-B1 FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS EVONIK OPERATIONS GMBH (DE) 2025-04-16 EP disclosed
WO-2024223378-A1 ON- AND OFFSHORE LONG-CHAIN POLYAMIDE TUBE WITH INCREASED BARRIER EFFECT EVONIK OPERATIONS GMBH (DE) 2024-10-31 WO disclosed
US-20240309179-A1 FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS EVONIK OPERATIONS GMBH (DE) 2024-09-19 US disclosed
US-20230228349-A1 COMPOSITION OF A MULTI-LAYER TUBE WITH A POLYAMIDE OUTER LAYER AND PROCESS FOR MAKING COOPER-STANDARD AUTOMOTIVE, INC. (US) 2023-07-20 US disclosed
US-20220097276-A1 COMPOSITION OF A MULTI-LAYER TUBE WITH A POLYAMIDE OUTER LAYER AND PROCESS FOR MAKING COOPER STANDARD AUTOMOTIVE, INC. (US) 2022-03-31 US disclosed
EP-3974172-A1 COMPOSITION OF A MULTI-LAYER TUBE WITH A POLYAMIDE OUTER LAYER AND PROCESS FOR MAKING Cooper-Standard Automotive, Inc. (US) 2022-03-30 EP disclosed
US-20020119272-A1 Polycaprolactam/polyhexamethylene adipamide multilayer composites for use as moldings for fuel, oil or heat lines on motor vehicles; chemical resistance DEGUSSA AG (DE) 2002-08-29 US disclosed
US-20020082352-A1 Adhesion DEGUSSA AG (DE) 2002-06-27 US disclosed
US-20020019477-A1 Molding materials; polyamide and addition polymer blend DEGUSSA-HUELS AKTIENGESELLSCHAFT (DE) 2002-02-14 US disclosed
US-5328884-A Salicylic acid salt,and amide or sulfonamide as developer KANZAKI PAPER MANUFACTURING CO., LTD. (JP) 1994-07-12 US disclosed
US-5250108-A Mixture of salicylic acid salt, amide and sulfonamide compounds KANZAKI PAPER MANUFACTURING CO. LTD. (JP) 1993-10-05 US disclosed
US-5032633-A Thermoplastic molding compositions with high cold impact strength HUELS AKTIENGESELLSCHAFT (DE) 1991-07-16 US disclosed
US-4959403-A FROM DECAMETHYLENEDIAMINE AND DODECANEDIOIC ACID, ESTER OR SULFONAMIDE PLASTICIZER HUELS AKTIENGESELLSCHAFT (DE) 1990-09-25 US disclosed
US-4904718-A Thermoplastic molding compounds which have impact strength when cold HUELS AKTIENGESELLSCHAFT (DE) 1990-02-27 US disclosed