SCHEMBL2237946

SCHEMBL2237946

C=C(C)C(=O)OCCOc1ccc(-c2nc(-c3ccccc3)nc(-c3ccccc3)n2)c(O)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.46
TDP1 Q9NUW8 2/20 0.46
APEX1 P27695 1/20 0.46
HTT P42858 1/20 0.46
MEN1 O00255 4/20 0.44
KMT2A Q03164 4/20 0.44
MAPT P10636 4/20 0.44
NPSR1 Q6W5P4 4/20 0.44
LMNA P02545 2/20 0.44
ALOX12 P18054 1/20 0.44
MAPK1 P28482 3/20 0.43
KDM4E B2RXH2 2/20 0.43
ALOX15 P16050 2/20 0.43
USP2 O75604 1/20 0.43
TP53 P04637 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HSD17B10 Q99714 1/20 0.43
GSTP1 P09211 3/20 0.42
GAA P10253 1/20 0.39
MAPK10 P53779 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29512556 1.00 POLB (0.46) POLBTDP1APEX1HTTMEN1
SCHEMBL8518667 1.00 POLB (0.46) POLBTDP1APEX1HTTMEN1
SCHEMBL14274498 0.98 POLB (0.45) POLBTDP1APEX1HTTMEN1
SCHEMBL16676012 0.94 POLB (0.51) POLBTDP1APEX1HTTMEN1
SCHEMBL8387421 0.94 POLB (0.56) POLBTDP1APEX1HTTMEN1
SCHEMBL30887153 0.94 POLB (0.56) POLBTDP1APEX1HTTMEN1
SCHEMBL8975634 0.94 POLB (0.56) POLBTDP1APEX1HTTMEN1
SCHEMBL19466444 0.94 POLB (0.56) POLBTDP1APEX1HTTMEN1
SCHEMBL8387123 0.91 POLB (0.53) POLBTDP1APEX1HTTMEN1
SCHEMBL30887135 0.91 POLB (0.53) POLBTDP1APEX1HTTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024181338-A1 COMPOSITION CONTAINING CARBON MATERIAL 株式会社日本触媒 2024-09-06 WO disclosed
CN-109699189-B Mask-integrated surface protective tape and method for manufacturing semiconductor chip using the same 古河电气工业株式会社 2024-01-30 CN disclosed
US-11862504-B2 Mask-integrated surface protective tape, and method of producing a semiconductor chip using the same FURUKAWA ELECTRIC CO., LTD. (JP) 2024-01-02 US disclosed
CN-114502680-B Adhesive composition 住友化学株式会社 2023-12-01 CN disclosed
CN-109937469-B Mask material for plasma dicing, mask-integrated surface protective tape, and method for manufacturing semiconductor chip 古河电气工业株式会社 2023-09-08 CN disclosed
US-11437243-B2 Mask material for plasma dicing, mask-integrated surface protective tape and method of producing semiconductor chip FURUKAWA ELECTRIC CO., LTD. (JP) 2022-09-06 US disclosed
CN-114502680-A Adhesive composition 住友化学株式会社 2022-05-13 CN disclosed
CN-114502687-A Adhesive composition 住友化学株式会社 2022-05-13 CN disclosed
CN-114450375-A Adhesive composition 住友化学株式会社 2022-05-06 CN disclosed
EP-3272775-B1 ULTRA VIOLET LIGHT ABSORBING MATERIALS FOR INTRAOCULAR LENS AND USES THEREOF BENZ RES AND DEVELOPMENT CORPORATION (US) 2021-11-03 EP disclosed
EP-1752508-B1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board NITTO DENKO CORP (JP) 2009-10-14 EP disclosed
US-20090110936-A1 Resin Composition for Forming Ultraviolet Absorbing Layer and Laminate Comprising Ultraviolet Absorbing Layer NIPPON SHOKUBAI CO., LTD. (JP) 2009-04-30 US disclosed
US-20080220235-A1 Amorphous Thermoplastic Resin and Extruded Film or Sheet NIPPON SHOKUBAI CO LTD (JP) 2008-09-11 US disclosed
US-20070036953-A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board NITTO DENKO CORPORATION 2007-02-15 US disclosed
EP-1752508-A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board. NITTO DENKO CORPORATION (JP) 2007-02-14 EP disclosed
CN-1912042-A Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board NITTO DENKO CORP (JP) 2007-02-14 CN disclosed
US-5869588-A UV ABSORBERS CIBA SPECIALTY CHEMICALS CORPORATION (US) 1999-02-09 US disclosed
US-5672704-A ULTRAVIOLET RADIATION STABILIZERS CIBA-GEIGY CORPORATION 1997-09-30 US disclosed
US-5538840-A SILVER HALIDE EMULSIONS AND POLYMERS ON SUBSTRATES WITH TRIAZINE PHENOLS CIBA-GEIGY CORPORATION (US) 1996-07-23 US disclosed
EP-0706083-A1 Photographic recording material containing an UV-absorber CIBA-GEIGY AG (CH) 1996-04-10 EP disclosed