SCHEMBL224625

SCHEMBL224625

C=CC1=CCONC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL983305 0.67
SCHEMBL1926088 0.67
SCHEMBL9061889 0.58
SCHEMBL3927155 0.55
SCHEMBL11172054 0.53
SCHEMBL28436097 0.52 MAPT (0.30)
SCHEMBL28464679 0.52
SCHEMBL8906682 0.50
SCHEMBL2140005 0.50
SCHEMBL1171304 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3296345-B1 HYDROLYTICALLY STABLE POLYAMIDE BLEND EVONIK OPERATIONS GMBH (DE) 2021-02-24 EP disclosed
EP-2998339-B1 METALLIC PIPE HAVING A HYDROLYSIS-RESISTANT LAYER OF A POLYAMIDE MOULDING COMPOSITION EVONIK DEGUSSA GMBH (DE) 2019-01-30 EP disclosed
US-10072786-B2 Use of a conduit pipe for producing a duct laid in water EVONIK DEGUSSA GMBH (DE) 2018-09-11 US disclosed
EP-2367883-B1 USE OF A COMPOSITION FOR THE CONTACT WITH SUPERCRITICAL MEDIA EVONIK DEGUSSA GMBH (DE) 2018-07-25 EP disclosed
EP-3296345-A1 HYDROLYTICALLY STABLE POLYAMIDE BLEND Evonik Degussa GmbH (DE) 2018-03-21 EP disclosed
US-9919494-B2 Metallic pipe having a hydrolysis-resistant layer of a polyamide moulding composition EVONIK DEGUSSA GMBH (DE) 2018-03-20 US disclosed
EP-2558285-B1 FLEXIBLE PIPE HAVING A DIFFUSION BARRIER EVONIK DEGUSSA GMBH (DE) 2017-08-16 EP disclosed
US-9574700-B2 Method of producing an underground pipeline EVONIK DEGUSSA GMBH (DE) 2017-02-21 US disclosed
US-9314989-B2 Flexible pipe having a multi-layered structure EVONIK DEGUSSA GMBH (DE) 2016-04-19 US disclosed
EP-2998339-A2 METALLIC PIPE HAVING A HYDROLYSIS-RESISTANT LAYER OF A POLYAMIDE MOULDING COMPOSITION Evonik Degussa GmbH (DE) 2016-03-23 EP disclosed
US-20070231520-A1 AIR BRAKE LINE DEGUSSA AG (DE) 2007-10-04 US disclosed
EP-1834763-A1 Compressed air brake pipe Degussa AG (DE) 2007-09-19 EP disclosed
WO-2006087249-A2 TRANSPARENT DECORATABLE MULTILAYER FILM DEGUSSA GMBH (DE) 2006-08-24 WO disclosed
EP-1217038-B1 Polyester moulding composition DEGUSSA (DE) 2005-12-28 EP disclosed
US-6660796-B2 Anhydride group-containing ethylene-alpha-olefin copolymer or styrene-ethylene/butylene block copolymer as impact modifier; ethylene-acrylic monomer terpolymer DEGUSSA AG (DE) 2003-12-09 US disclosed
US-6579581-B2 Molding materials; polyamide and addition polymer blend DEGUSSA AG (DE) 2003-06-17 US disclosed
US-20020115771-A1 Polyester molding composition DEGUSSA AG (DE) 2002-08-22 US disclosed
EP-1217038-A2 Polyester moulding composition Degussa AG (DE) 2002-06-26 EP disclosed
US-20020019477-A1 Molding materials; polyamide and addition polymer blend DEGUSSA-HUELS AKTIENGESELLSCHAFT (DE) 2002-02-14 US disclosed
EP-1170334-A2 Low-temperature shock resistant polyamide moulding Degussa AG (DE) 2002-01-09 EP disclosed