SCHEMBL22471729

SCHEMBL22471729

C=CC(=O)OC(CCCCCCCCCCCCCCCCC)OP(=O)(O)O

nearest known ligand 0.66

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
SMPD1 P17405 3/20 0.66
PTPN1 P18031 1/20 0.43
FDPS P14324 4/20 0.41
TSHR P16473 2/20 0.40
HPGD P15428 1/20 0.40
S1PR2 O95136 5/20 0.40
S1PR1 P21453 5/20 0.40
S1PR3 Q99500 5/20 0.40
S1PR4 O95977 4/20 0.40
LAP3 P28838 1/20 0.39
LPAR3 Q9UBY5 3/20 0.38
LPAR1 Q92633 2/20 0.38
LPAR2 Q9HBW0 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28013609 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL21541950 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL21541952 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL30409620 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL28974319 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL23581995 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL22129973 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL21496268 1.00 SMPD1 (0.66) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL6783963 0.98 SMPD1 (0.63) SMPD1PTPN1FDPSTSHRHPGD
SCHEMBL6791410 0.94 SMPD1 (0.56) SMPD1PTPN1FDPSTSHRHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4682939-A1 POLISHING COMPOSITION, CONCENTRATED LIQUID OF POLISHING COMPOSITION, AND POLISHING METHOD Fujimi Incorporated (JP) 2026-01-21 EP disclosed
WO-2025069725-A1 POLISHING COMPOSITION, CONCENTRATED SOLUTION OF POLISHING COMPOSITION, AND POLISHING METHOD 株式会社フジミインコーポレーテッド 2025-04-03 WO disclosed
WO-2023079620-A1 INKJET INK FOR FORMING PARTITION, INKJET INK SET FOR FORMING PARTITION, METHOD FOR MANUFACTURING LED DEVICE, AND LED DEVICE コニカミノルタ株式会社 2023-05-11 WO disclosed
WO-2023079622-A1 INKJET INK FOR PARTITION WALL FORMATION, INKJET INK SET FOR PARTITION WALL FORMATION, AND LED DEVICE MANUFACTURING METHOD コニカミノルタ株式会社 2023-05-11 WO disclosed
CN-115703207-A Surface treatment method, method for manufacturing semiconductor substrate, surface treatment composition, and system for manufacturing semiconductor substrate 福吉米株式会社 2023-02-17 CN disclosed
WO-2020194978-A1 SURFACE TREATMENT COMPOSITION, METHOD FOR MANUFACTURING SAME, SURFACE TREATMENT METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE 株式会社フジミインコーポレーテッド 2020-10-01 WO disclosed