⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2029 | 0.93 | — | — | |
| SCHEMBL4591460 | 0.93 | — | — | |
| SCHEMBL3684134 | 0.86 | — | — | |
| SCHEMBL8781203 | 0.86 | — | — | |
| SCHEMBL7592419 | 0.86 | — | — | |
| SCHEMBL23452072 | 0.86 | — | — | |
| SCHEMBL20636754 | 0.86 | — | — | |
| SCHEMBL20636756 | 0.86 | — | — | |
| SCHEMBL7907603 | 0.86 | — | — | |
| SCHEMBL1636356 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117995762-A | Method for manufacturing semiconductor element with auxiliary feature | 南亚科技股份有限公司 | 2024-05-07 | — | — | CN | claimed |
| CN-100513636-C | Organometallic compounds | ROMA AND HAAS ELECTRONIC MATER (US) | 2009-07-15 | — | — | CN | claimed |
| CN-122080374-A | Furan polyester composition and application thereof | — | 2026-05-26 | — | — | CN | disclosed |
| CN-120040743-A | Catalyst solution and preparation method thereof, polyester composition and preparation method and application thereof | 东丽纤维研究所（中国）有限公司 | 2025-05-27 | — | — | CN | disclosed |
| CN-118782537-A | Semiconductor element with filling layer and preparation method thereof | 南亚科技股份有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-118782538-A | Method for manufacturing semiconductor element with filling layer | 南亚科技股份有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-118684869-A | Polyester composition, and preparation method and application thereof | 东丽纤维研究所（中国）有限公司 | 2024-09-24 | — | — | CN | disclosed |
| CN-118630043-A | Semiconductor element with capping layer | 南亚科技股份有限公司 | 2024-09-10 | — | — | CN | disclosed |
| US-12051586-B2 | Method of manufacturing semiconductor device | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-07-30 | — | — | US | disclosed |
| CN-118099128-A | Semiconductor element and method for manufacturing the same | 南亚科技股份有限公司 | 2024-05-28 | — | — | CN | disclosed |
| CN-118099196-A | Semiconductor element with energy removable layer | 南亚科技股份有限公司 | 2024-05-28 | — | — | CN | disclosed |
| CN-117995752-A | Semiconductor element and method for manufacturing the same | 南亚科技股份有限公司 | 2024-05-07 | — | — | CN | disclosed |
| CN-117995762-A | Method for manufacturing semiconductor element with auxiliary feature | 南亚科技股份有限公司 | 2024-05-07 | — | — | CN | disclosed |
| WO-2022138854-A1 | TEMPERATURE SENSITIVE PROBE | 株式会社ダイセル | 2022-06-30 | — | — | WO | disclosed |
| US-20210175073-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2021-06-10 | — | — | US | disclosed |
| WO-2020195998-A9 | EXPLOSIVE COMPOSITION AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING HETEROATOM-DOPED NANODIAMOND | 株式会社ダイセル | 2020-12-03 | — | — | WO | disclosed |
| WO-2020195998-A1 | EXPLOSIVE COMPOSITION AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING HETEROATOM-DOPED NANODIAMOND | 株式会社ダイセル | 2020-10-01 | — | — | WO | disclosed |
| CN-100513636-C | Organometallic compounds | ROMA AND HAAS ELECTRONIC MATER (US) | 2009-07-15 | — | — | CN | disclosed |