Phenethylamine

Phenethylamine

SCHEMBL22472091

CCCN.NCCc1ccccc1

nearest known ligand 0.80

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 4/20 0.80
TAAR1 Q96RJ0 3/20 0.80
CYP2A6 P11509 2/20 0.80
SMN1; SMN2 Q16637 1/20 0.80
LOXL2 Q9Y4K0 1/20 0.80
MAOA P21397 3/20 0.56
CYP1A2 P05177 2/20 0.52
MAOB P27338 2/20 0.52
CYP2D6 P10635 1/20 0.52
CYP2C19 P33261 1/20 0.52
HTR6 P50406 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenethylamine SCHEMBL22472096 0.92 HTR2A (0.84) HTR2ATAAR1CYP2A6SMN1; SMN2LOXL2
Propylamine SCHEMBL27818094 0.90 HTR2A (0.64) HTR2ATAAR1CYP2A6SMN1; SMN2LOXL2
Phenethylamine SCHEMBL19693170 0.90 TAAR1 (0.89) HTR2ATAAR1CYP2A6SMN1; SMN2LOXL2
Phenethylamine SCHEMBL16584870 0.89 HTR2A (0.64) HTR2ATAAR1CYP2A6SMN1; SMN2LOXL2
Phenethylamine SCHEMBL1332244 0.89
Phenethylamine SCHEMBL1799333 0.89 HTR2A (1.00) HTR2ATAAR1CYP2A6SMN1; SMN2LOXL2
Phenethylamine SCHEMBL1330939 0.89
Phenethylamine SCHEMBL968 0.89
Phenethylamine SCHEMBL1331271 0.89
Phenethylamine SCHEMBL27634208 0.89 HTR2A (1.00) HTR2ATAAR1CYP2A6SMN1; SMN2LOXL2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118984828-A Compound, method for producing the compound, curable material, curable composition, method for producing cured product, and cured product 株式会社艾迪科 2024-11-19 CN disclosed
CN-118679204-A Curing agent and adhesive for epoxy resin 盛势达技研株式会社 2024-09-20 CN disclosed
CN-118369320-A Compound, curable resin composition, and cured product 株式会社艾迪科 2024-07-19 CN disclosed
CN-113544183-B Curable resin composition 株式会社艾迪科 2024-07-02 CN disclosed
CN-118076588-A Inclusion compound, epoxy resin curing agent, and curable resin composition 株式会社艾迪科 2024-05-24 CN disclosed
CN-118055978-A Curable resin composition, cured product, and adhesive 株式会社艾迪科 2024-05-17 CN disclosed
CN-117413002-A Epoxy resin composition 株式会社艾迪科 2024-01-16 CN disclosed
CN-115003726-B Curable resin composition and method for inhibiting curing shrinkage of curable resin composition 株式会社艾迪科 2023-12-05 CN disclosed
CN-117043221-A Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article DIC株式会社 2023-11-10 CN disclosed
CN-116940613-A Curable resin composition, cured product, and adhesive 株式会社艾迪科 2023-10-24 CN disclosed
CN-115003709-A Compound, method for producing compound, and curable composition 株式会社艾迪科 2022-09-02 CN disclosed
CN-115003726-A Curable resin composition and method for suppressing curing shrinkage of curable resin composition 株式会社艾迪科 2022-09-02 CN disclosed
CN-114207039-A Curable resin composition 株式会社艾迪科 2022-03-18 CN disclosed
CN-113544183-A Curable resin composition 株式会社艾迪科 2021-10-22 CN disclosed
WO-2021112104-A1 RESIN COMPOSITION 株式会社ADEKA 2021-06-10 WO disclosed
WO-2021112091-A1 RESIN COMPOSITION 株式会社ADEKA 2021-06-10 WO disclosed
WO-2021095534-A1 CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR DIC株式会社 2021-05-20 WO disclosed
WO-2021049390-A1 CURABLE RESIN COMPOSITION 株式会社ADEKA 2021-03-18 WO disclosed
WO-2020196819-A1 CURABLE RESIN COMPOSITION 株式会社ADEKA 2020-10-01 WO disclosed
CN-107001593-B Thermosetting resin composition 三键有限公司 2020-01-17 CN disclosed