SCHEMBL22493525

SCHEMBL22493525

C=CCCCCCCCCCCC(=O)Cl

nearest known ligand 0.64

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.64
ABCC4 O15439 1/20 0.64
ALDH1A1 P00352 6/20 0.55
LMNA P02545 2/20 0.55
TSHR P16473 5/20 0.50
TP53 P04637 1/20 0.42
LPAR3 Q9UBY5 2/20 0.41
LPAR2 Q9HBW0 1/20 0.41
CYP3A4 P08684 3/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
USP2 O75604 2/20 0.40
RECQL P46063 1/20 0.40
HPGD P15428 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
DAGLA Q9Y4D2 1/20 0.35
TRPA1 O75762 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8379461 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL851421 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL3949411 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL455091 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL19183533 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL8816470 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL23292927 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL8376443 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL22493546 1.00 MAPT (0.64) MAPTABCC4ALDH1A1LMNATSHR
SCHEMBL674834 0.98

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11111348-B2 Method for treating surface of resin material layer and resin material MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) 2021-09-07 US disclosed
EP-3450488-B1 METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL MITSUBISHI HEAVY IND LTD (JP) 2021-03-24 EP disclosed
US-20200317876-A1 METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) 2020-10-08 US disclosed